Light-emitting diode package
A technology of light-emitting diodes and encapsulation layers, applied in electrical components, electrical solid-state devices, circuits, etc.
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[0053] Figure 1A to Figure 1J It is a schematic cross-sectional view of the manufacturing method of the light emitting diode package according to the first embodiment of the present invention. Figure 1K It is a schematic top view of the light emitting diode package of the first embodiment of the present invention. Figure 1L It is a schematic bottom view of the light emitting diode package of the first embodiment of the present invention. Figure 1M It is a circuit diagram of the light emitting diode package of the first embodiment of the present invention.
[0054] First, please refer to Figure 1A , Provide a temporary carrier board 10. The material of the temporary carrier 10 can be glass, quartz, wafer, organic polymer, metal, etc. Other suitable materials can also be used as the temporary carrier board 10, as long as the aforementioned materials can support the film layer or member formed thereon and can withstand the subsequent manufacturing process, which is not limited in...
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