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Light-emitting diode package

A technology of light-emitting diodes and encapsulation layers, applied in electrical components, electrical solid-state devices, circuits, etc.

Active Publication Date: 2019-06-28
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The shading layer is located on the circuit layer

Method used

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  • Light-emitting diode package
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Examples

Experimental program
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Embodiment Construction

[0053] Figure 1A to Figure 1J It is a schematic cross-sectional view of the manufacturing method of the light emitting diode package according to the first embodiment of the present invention. Figure 1K It is a schematic top view of the light emitting diode package of the first embodiment of the present invention. Figure 1L It is a schematic bottom view of the light emitting diode package of the first embodiment of the present invention. Figure 1M It is a circuit diagram of the light emitting diode package of the first embodiment of the present invention.

[0054] First, please refer to Figure 1A , Provide a temporary carrier board 10. The material of the temporary carrier 10 can be glass, quartz, wafer, organic polymer, metal, etc. Other suitable materials can also be used as the temporary carrier board 10, as long as the aforementioned materials can support the film layer or member formed thereon and can withstand the subsequent manufacturing process, which is not limited in...

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Abstract

The invention discloses a light-emitting diode package which comprises a line layer, a light shielding layer, a plurality of light-emitting diodes and a packaging layer. The thickness of the line layer is smaller than 100 micrometers. The light shielding layer is on the line layer. The light shielding layer has multiple openings. The light emitting diodes are configured on the line layer and in the openings of the light shielding layer. The light emitting diodes are electrically connected with the line layer. The packaging layer covers the light shielding layer. The refractivity of the packaging layer is 1.4-1.7. The Young's modulus of the packaging layer is higher than or equal with 1GPa. The thickness of the packaging layer is higher than that of the light emitting diode.

Description

Technical field [0001] The invention relates to a photoelectric element structure and a manufacturing method thereof, and in particular to a light emitting diode package and a manufacturing method thereof. Background technique [0002] Light emitting diodes (LEDs) have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption. Therefore, they have been widely used as indicators or light sources in households and various devices. In recent years, light-emitting diodes have developed toward multi-color and high-brightness, so their application areas have been extended to large outdoor billboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions. [0003] Generally, in a display device with light-emitting diodes, the light-emitting diodes can usually be arranged on a circuit substrate through surface mount ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/56H01L33/62H01L25/16
Inventor 吴明宪蔡曜骏赵嘉信方彦翔林奕辰叶瀞雅
Owner IND TECH RES INST
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