Ink, and preparation method and applications thereof

A technology of ink and glycidyl ether, applied in the field of ink and its preparation, can solve the problems of inability to meet high-speed and high-frequency requirements and the like

Active Publication Date: 2019-07-02
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary plugging resin T g 140~180℃, (T>Tg)α of thermal expansion coefficient 2 >120μm/(m.℃), the best Japanese Shanrong pro

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ink, and preparation method and applications thereof
  • Ink, and preparation method and applications thereof
  • Ink, and preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0044] A kind of preparation method of ink,

[0045] Step S01: taking each component according to the components contained in the ink and the content of each component;

[0046] Step S02: uniformly mixing the first epoxy resin, the second epoxy resin, epoxy monomers and additives;

[0047] Step S03: adding curing agent and inorganic filler while dispersing, grinding the slurry to a certain fineness, and performing degassing treatment to form the ink.

[0048] Among them, step S03 is specifically to add curing agent and inorganic filler material while dispersing, control the temperature below 50°C, disperse at high speed for 15-20 minutes, and grind at least 3 times with three rollers until the inorganic filler material reaches a certain fineness. The density is less than or equal to 15 μm, and then transferred to a vacuum stirring and degassing machine for degassing until the material has no bubbles, and finally the material is divided and subjected to centrifugal degassing t...

Embodiment 1

[0052] This embodiment provides a kind of ink, and described ink comprises following mass percent: 4,4'-methylene bis (N, N-diglycidyl aniline) 20%, triglycidyl p-aminophenol 20% %, 1,4-cyclohexanedimethanol diglycidyl ether 2%, DDS0.2%, 2-methylimidazole trimeric isocyanate 2.8%, calcium carbonate 53.8%, BYK-110 1%, BYK- A550 0.2%.

[0053] Its preparation method comprises the following steps:

[0054] S11: 4,4'-methylene bis(N,N-diglycidyl aniline), triglycidyl p-aminophenol, 1,4-cyclohexanedimethanol diglycidyl ether, BYK-110, After BYK-A550 is mixed according to the ratio, it is dispersed evenly by the disperser at high speed;

[0055] S12: Add DDS, 2-methylimidazole isocyanate and calcium carbonate while dispersing, control the temperature below 50°C, disperse at a high speed for 15-20 minutes, and grind at least 3 times with three rollers to a certain fineness of 15 μm;

[0056] S13: Vacuum stirring and defoaming machine degasses until the material has no bubbles, and...

Embodiment 2

[0058] This embodiment provides an ink, and the ink includes the following mass percentages: 4,4'-methylene bis(N,N-diglycidyl aniline) 10%, tetraglycidyl-1,3 -Bisaminomethylcyclohexane 10%, triglycidyl p-aminophenol 20.3%, p-tert-butylphenyl glycidyl ether 1%, trimethylolpropane triglycidyl ether 1.5%, DDS 0.2%, 2-Methylimidazole trimeric isocyanate 2.8%, calcium carbonate 53%, BYK-110 1%, BYK-A550 0.2%.

[0059] Its preparation method refers to the preparation method of Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Finenessaaaaaaaaaa
Login to view more

Abstract

The invention discloses an ink, and a preparation method and applications thereof. The ink comprises a first epoxy resin, a second epoxy resin, an epoxy monomer, a curing agent, an inorganic filling material, and an auxiliary agent. The preparation method comprises following steps: weighing the components; mixing the first epoxy resin, the second epoxy resin, the epoxy monomer and the auxiliary agent to be uniform, adding the curing agent and the inorganic filling material while dispersing, grinding and defoaming so as to obtain the ink. The ink is high in heat resistance; the Tg is larger than 200 DEG C; matching with 5G high-frequency substrate deformation characteristics in heating is ensured; the thermal expansion coefficient is low; (T>Tg) alpha2<80 <mu>m/(m. DEG C); under high temperature conditions, matching of plugging ink unit temperature heating expansion rate with PCB substrate after curing is ensured.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to an ink and its preparation method and application. Background technique [0002] As electronic products tend to be more multi-functional and miniaturized, circuit boards such as printed circuit boards (PCB) are also developing towards multi-layer and high-density. This puts forward new requirements for the materials of printed circuit boards, requiring higher thermal conductivity and thermal stability of circuit board materials, and at the same time, it also puts forward higher requirements for the plugging process and plugging materials of printed circuit boards. [0003] Printed circuit boards are mainly composed of lines and graphics, dielectric layers, via holes, solder resist inks, silk screens, surface treatment layers, etc. Among them, plugging resin is an important buried hole material and is mainly used for high-density interconnected printed cir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09D11/102C09D11/03H05K3/00
CPCC09D11/03C09D11/102H05K3/0094H05K2201/0959
Inventor 王亮亮
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap