Method for nondestructive inspection by ultrasound of a bonded assembly
A component and bonding technology, which is applied in the direction of material analysis using sound wave/ultrasonic wave/infrasonic wave, solid state analysis using sound wave/ultrasonic wave/infrasonic wave, processing detection response signal, etc., can solve the problem of measuring adhesion and hindering the generalization of bonding technology , Quantify the mechanical strength of the bonded components, etc., to achieve the effect of easy inspection
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[0031] now refer to figure 1 . figure 1 A sample of the glued component 1 on which the first step of the described method was applied is shown. The bonded component 1 is a component composed of a first layer 3 composed of a first composite material and a second layer 5 assembled together by an adhesive connection 7, the second layer may consist of a second composite material or Not comprised of the second composite material.
[0032] An ultrasound device 9 is placed in contact with the sample of the bonded component 1 . In the example shown, the ultrasound device 9 is a multi-element ultrasound 11 transducer 9 which acts in contact. The intrinsic properties of the transducer 9 (flat or flexible, number of elements 11, size, center frequency, etc.) may differ depending on the bonded assembly 1 considered, in order to enable the generation / detection of the physical phenomena involved ( In particular, the emission and acquisition of the emitted ultrasound signal 12 are optimi...
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