Semiconductor wafer cutting device with pneumatic stability and based on magnetic pole pressurizing principle

A cutting device and semiconductor technology, applied in the semiconductor field, can solve problems such as wash-off, wafer integrity restrictions, etc., and achieve the effect of increasing sliding

Active Publication Date: 2019-07-05
浙江积成星科技有限公司
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  • Summary
  • Abstract
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  • Application Information

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Problems solved by technology

[0003] The current technology separates the chip raw material on the silicon crystal board from the board body through horizontal cutting, so as to carry out extraction. Since the cooling liquid is generally us

Method used

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  • Semiconductor wafer cutting device with pneumatic stability and based on magnetic pole pressurizing principle
  • Semiconductor wafer cutting device with pneumatic stability and based on magnetic pole pressurizing principle
  • Semiconductor wafer cutting device with pneumatic stability and based on magnetic pole pressurizing principle

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Example Embodiment

[0029] Example

[0030] See Figure 1-Figure 7 , The present invention provides a pneumatically stable semiconductor wafer cutting device based on the principle of magnetic pole pressurization. The structure includes an observation shaft base 1, a moving platform 2, a gantry guide 3, a fixed base 4, a processing turntable 5, and a cutter 6. The turntable 5 is installed in the middle of the surface of the fixed base 4 by buckling. The fixed base 4 is provided with a gantry guide 3 at the top and rear end. The bottom of the mobile platform 2 is installed on the upper end of the gantry guide 3 by buckling. The rear end of the shaft base 1 is fitted with the front end of the mobile platform 2, and the cutter 6 is installed at the bottom of the observation shaft base 1 by buckling. Through the observation of the shaft base 1, the cutting work of the cutter 6 can be enlarged and observed. The processing turntable 5 is used to place the processed wafer plates.

[0031] The cutter 6 incl...

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Abstract

The invention discloses a semiconductor wafer cutting device with pneumatic stability and based on the magnetic pole pressurizing principle. The semiconductor wafer cutting device structurally comprises an observing shaft seat, a moving platform, a gantry guiding frame, a fixed base, a processing rotating table, and a cutting machine, the processing rotating table is mounted in the middle of the surface of the fixed base through a buckling fit manner, the gantry guiding frame is arranged at the back end of the top of the fixed base, and the bottom of the moving platform is mounted at the upperend of the gantry guiding frame through the buckling fit manner. According to the semiconductor wafer cutting device, the angle of a gravitational cooler is ensured by a gravity leading box, the pressurizing output is conducted on the gas by a rotating pressure disc, the pneumatic operation is conducted on the bottom of a cutting sheet, the problem that a chip raw material is stripped by the cooling water in the cutting process is solved accordingly, a water-cooled head is designed to two-side cooling, the chip raw material is effectively prevented from flushing away by a coolant, and the integrity of the wafer after cutting is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an aerodynamically stable semiconductor wafer cutting device based on the principle of magnetic pole boosting. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called wafer. Wafer is the basic material for manufacturing semiconductor chips. During manufacture, silicon crystals are obtained through a long process of growing After cutting, rolling, slicing, chamfering, polishing, and laser engraving, the silicon wafer and the board are separated to become the chip raw material of the integrated circuit factory. There are such problems in the use of existing wafer cutting devices on the market: [0003] The current technology separates the chip raw material on the silicon crystal board from the board body through horizontal cutting, so as to carry out extraction. Since...

Claims

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Application Information

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IPC IPC(8): B28D5/02B28D7/00B28D7/02H01L21/304
CPCB28D5/0058B28D5/0076B28D5/023H01L21/304
Inventor 刘燕枝黄荣章骆卫钦陈秀珍
Owner 浙江积成星科技有限公司
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