Manufacturing method of multilayer plate laser through hole

Abstract

The invention provides a manufacturing method of a multilayer plate laser through hole, characterized in that the method specifically includes the following steps of: step 1, preparing a multilayer plate, wherein the multilayer plate sequentially includes a first copper layer, a first polyimide layer, a second copper layer, a thermosetting adhesive layer, a second polyimide layer and a third copper layer from top to bottom; step 2, lasering a blind hole at a preset design hole of the multilayer plate, wherein the bottom end of the blind hole is connected to the upper end surface of the secondcopper layer; and step 3, lasering a through hole at the position of the blind hole. According to the scheme of the invention, a blind hole which is slightly smaller than the designed aperture is lasered first, the blind hole needs to ensure that the first copper layer, the first polyimide layer and the thermosetting adhesive layer are lasered off, and then a through hole meeting the design requirements is lasered to ensure that the adhesive residue does not remain in the orifice; and by adopting a through hole lasering method of the patent, the adhesive residue at the orifice can be eliminated, and the phenomenon that an additional post-treatment process is required to remove the adhesive residue at the orifice after through hole lasering can be avoided.

Description

[0001] Technical field: [0002] The invention relates to the technical field of laser through holes in multilayer boards, in particular to a method for manufacturing laser through holes in multilayer boards. [0003] Background technique: [0004] With the increasing precision of electronic products, the design of flexible circuit boards has a trend of high density, multi-layer boards, and small apertures. For multi-layer boards and small-aperture flexible circuit boards, the conventional laser through-hole is a one-time molding, and the through-hole is directly lasered out. Since the multi-layer board needs thermosetting glue for pressing and cross-linking, if the laser through hole is adopted in the conventional scheme, the thermosetting glue will splash to the hole and stick to the hole and cannot be removed, such as image 3 As shown, the through-hole laser of the multi-layer board adopts the board surface effect after one-step forming, and the hole has residual glue. In ...

AI Technical Summary

Problems solved by technology

Since the multi-layer board needs thermosetting glue for pressing and cross-linking, if the laser through hole is adopted in the conventional scheme, the thermosetting glue will splash to the hole and stick to the hole and cannot be removed, such as image 3 As shown, the through-hole laser of the multi-layer board adopts the board surface effect after one-step forming, and the hole has residual glue

In the subsequent processing process, the residual glue splashed to the orifice cannot be completely removed, resulting in a high defective rate

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