A method of making a phase change heat sink for radio frequency microsystem components

Abstract

The invention discloses a method for manufacturing a phase-change radiator for radio frequency microsystem components. The specific processing includes the following steps: 101) RF chip adapter board processing step, 102) radiator adapter board manufacturing step, 103) heat dissipation area Manufacturing step, 104) Bonding step; the present invention provides a new method for manufacturing a phase-change heat sink for radio frequency microsystem components that takes away a large amount of heat and reduces chip temperature.

Description

technical field [0001] The invention relates to the field of semiconductor technology, more specifically, it relates to a manufacturing method of a phase-change heat sink for radio frequency microsystem components. Background technique [0002] Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. Millimeter-wave radio frequency integrated circuits also have huge actual needs and potential markets. [0003] But for high-power chips, only the heat dissipation configuration at the bottom is used. The heat generated by the RF chip will gather near the metal block at the bottom of the chip, resulting in local overheating, and the surrounding adapter boards have limited heat export effect because there is no metal. . At the same time, the chip transfers heat to the copper inlaid on the PCB, which needs to pass through the soldering surface of the chip and the base, the soldering s...

AI Technical Summary

Problems solved by technology

[0003] But for high-power chips, only the heat dissipation configuration at the bottom is used. The heat generated by the RF chip will gather near the metal block at the bottom of the chip, resulting in local overheating, and the surrounding adapter boards have limited heat export effect because there is no metal.

At the same time, the chip transfers heat to the copper inlay on the PCB, which needs to pass through the soldering surface of the chip and the base, the soldering surface and the TSV copper pillar, and the copper pillar and the copper inlaid bottom of the microsystem. The distance is long and the heat transfer effect is poor.

Relying on the PCB board for heat dissipation is to conduct the heat of the chip to the shell. If the pure heat conduction in the Z-axis direction touches the PCB board, the heat transfer effect is not good, which will be unfavorable for matching higher power chips.

Images