A Complementary Three-Dimensional Broadband Capacitor Based on Coaxial Through-Silicon Via Array
A technology of through-silicon vias and capacitors, which is applied in capacitors, electric solid devices, circuits, etc., can solve the problems that cannot meet the development needs of radio frequency/microwave integrated circuits, low capacitance density, self-resonant frequency and quality factor, and unfavorable miniaturization of integrated circuits And monolithic integration and other issues, to achieve the effect of occupying a small chip area, reducing parasitic parameters, and good capacitor voltage characteristics
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[0044] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, a complementary three-dimensional integrated broadband capacitor based on a coaxial through-silicon via array proposed according to the present invention will be described below in conjunction with the accompanying drawings and specific implementation methods. Detailed description.
[0045] The aforementioned and other technical contents, features and effects of the present invention can be clearly presented in the following detailed description of specific implementations with accompanying drawings. Through the description of specific embodiments, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the accompanying drawings are only for reference and description, and are not used to explain the technical aspects of the present invention. program is ...
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