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Testing method of contact heat resistance between circular section one-dimensional nanostructures

A nano-structure, circular cross-section technology, applied in the field of thermophysical parameter testing of solid materials, can solve the problems of high sample quality consistency requirements, easy damage or loss of samples, and reduced test success rate, so as to improve the test success rate and improve Measurement accuracy, effect of reducing requirements

Active Publication Date: 2019-07-19
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its shortcoming is: 1) test success rate is low
In this test scheme, it is necessary to move the nanostructure in a large range, which is easy to damage or lose the sample and reduce the success rate of the test; 2) High requirements for sample quality consistency

Method used

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  • Testing method of contact heat resistance between circular section one-dimensional nanostructures
  • Testing method of contact heat resistance between circular section one-dimensional nanostructures
  • Testing method of contact heat resistance between circular section one-dimensional nanostructures

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Embodiment Construction

[0042] The test scheme for contact thermal resistance between one-dimensional nanostructures with circular cross-sections disclosed by the present invention adopts a thermal bridge method as a test technique. The present invention will be described in further detail below in conjunction with the accompanying drawings and implementation examples.

[0043] figure 1 The schematic diagram of the thermophysical properties of one-dimensional nanostructures tested by the thermal bridge method is given. The method uses a suspended micro-device prepared by MEMS technology, including a suspended heat source 1 and a heat sink 7 , a plurality of first suspension arms 3 supporting the heat source, a plurality of second suspension arms 5 supporting the heat sink, and a substrate 4 . The first microcoil 2 and the second microcoil 6 are made respectively on the heat source 1 and the heat sink 7, wherein the first microcoil 2 is used as a heater and a temperature sensor to heat the heat sourc...

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Abstract

The invention discloses a testing method of contact heat resistance between circular section one-dimensional nanostructures. The method comprises the following steps: breaking a circular section one-dimensional nanostructure into two sections by using a micro manipulator under an optical microscope or a scanning electron microscope, wherein two sections are respectively lapped at a heat source anda heat sink of an overhead microdevice; enabling two sections of specimens to form parallel contact between the heat source and the heat sink; testing the sample by adopting a heat bridge method, thereby obtaining apparent heat resistance Rtot1; changing two sections of specimens as cross contact from parallel contact by using the microdevice under the optical microscope or the scanning electronmicroscope, testing the sample by adopting the heat bridge method so as to obtain the apparent heat resistance Rtot2, wherein the contact heat resistance of the unit area between two sections of specimens can be approximate as RCA=(Rtot2-Rtot1)*Ac2, wherein the AC2 is the contact area of the cross contact between two sections of specimens. The testing successful rate is improved, the specimen quality consistency requirement is reduced, and the testing precision is improved.

Description

technical field [0001] The invention belongs to the technical field of testing thermal physical property parameters of solid materials, and in particular relates to a testing method for contact thermal resistance between circular cross-section one-dimensional nanostructures. Background technique [0002] The contact thermal resistance between one-dimensional nanostructures is of great value for the design of microelectronic devices and thermal interface materials. The reported test schemes for measuring the contact thermal resistance between one-dimensional nanostructures can be divided into two categories: one can be called multi-point method, and the other can be called single-point method. [0003] In the multi-point method, the nanostructures are stacked into a film, so that there are a large number of contact points between the nanostructures in the film, and the thermal contact resistance between the nanostructures can be inversely deduced by testing the thermal proper...

Claims

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 杨决宽
Owner SOUTHEAST UNIV
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