Processing method and processing system of circuit board

A processing method and processing system technology, applied in the directions of printed circuit, printed circuit manufacturing, lithography/pattern, etc., can solve problems such as deformation, cutting near surface or point warping, etc., and achieve simple process, narrow line spacing and low cost. Effect

Active Publication Date: 2019-07-19
奈米科技(深圳)有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a bonding-assisted laser cutting circuit board process, which overcomes the above-mentioned defects of the prior art, such as solving the warping or deformation of the surface or point near the cutting caused by the heat of the copper foil during cutting. problems, and effectively maintain the accuracy of laser cutting patterns

Method used

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  • Processing method and processing system of circuit board
  • Processing method and processing system of circuit board
  • Processing method and processing system of circuit board

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Embodiment Construction

[0046] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0047] Such as figure 1 As shown, the present invention provides a preferred embodiment of a circuit board processing method.

[0048] A processing method for a circuit board, the steps of the processing method comprising:

[0049] Step S11, bonding the substrate, setting a copper foil on the substrate through the adhesive layer;

[0050] Step S12, laser processing, laser cutting the copper foil according to the preset circuit diagram to obtain the first semi-finished circuit board;

[0051] Step S13, copper stripping treatment to obtain the second semi-finished circuit board;

[0052] Step S14, filling with ink or paint, using ink or paint to fill the laser-cut gap, and forming a layer of ink / paint on the surface of the copper foil to obtain a third semi-finished circuit board;

[0053] Step S15, separating the copper foil and the sub...

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Abstract

The invention relates to the technical field of laser processing, in particular to a processing method and processing system of a circuit board. The processing method comprises the steps of pasting asubstrate, and arranging a copper foil on the substrate by a pasting layer; performing laser processing; performing copper withdrawing; filling ink or a coating material; separating the copper foil from the substrate; and cleaning to obtain a finished product of the circuit board. The copper foil is pasted onto the substrate and then is cut, warping or deformation of the copper foil after heatingduring laser cutting can be effectively prevented, so that error influence on a cutting line and depth is eliminated; meanwhile, a product with narrower line distance can be obtained; and moreover, agroove after cutting is filled with an insulation filler such as the ink after a cutting pattern is obtained, the pattern is further protected and fixed, a more accurate pattern is obtained, the processing method is simple in process and low in cost, and production demand on a large scale is facilitated.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board processing method and a processing system. Background technique [0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beams and substances to perform cutting, welding, surface treatment, drilling and micro-processing of materials (including metals and non-metals). [0003] Laser cutting of circuit boards uses the high-energy and strong beam of the laser to achieve instantaneous high temperature in the area scanned by the laser through photothermal conversion to vaporize the copper foil. [0004] In the prior art, when the laser cuts the circuit board, if the copper foil is not on a fixed surface, the laser processing will cause deformation and warping of the copper foil under the condition of high heat dissipation, thereby changing the height of the copper foil processing sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02
CPCH05K3/027H05K2203/0528
Inventor 夏丽红
Owner 奈米科技(深圳)有限公司
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