PCB assembly, manufacturing method of PCB assembly and electronic device
A manufacturing method and technology for electronic equipment, which are applied in the manufacture of printed circuits, assembling printed circuits with electrical components, and printed circuits, etc., can solve problems such as warping of the upper board, poor performance of PCB components, and reduced product yield of PCB components. , to achieve the effect of improving comprehensive practical performance, improving product yield, and enhancing market competitiveness
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[0027] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.
[0028] Refer below Figure 1-Figure 3 A PCB (Printed Circuit Board, printed circuit board) assembly according to an embodiment of the present application is described, including: a bottom main board 11 , an upper board 13 and at least one interlayer board 12 .
[0029] Such as figure 1 As shown, the bottom main board 11 can be provided with a first electronic component 111, the interlayer board 12 can be arranged between the bottom main board 11 and the upper board 13, the bottom main board 11 and the upper board 13 can be ...
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