Method for adjusting surface density of high-tensile-resistance copper foil

Abstract

The invention discloses a method for adjusting the surface density of a high-tensile-resistance copper foil. The method comprises the following steps that the surface density value of the transverse position of the copper foil is acquired, a surface density curve is drawn, smooth processing is carried out, an insulating shielding rubber tape which is overlapped with the obtained smooth curve is correspondingly cut according to the smooth surface density curve, the insulation shielding rubber tape is attached to an anode plate in the axial direction, and in the next copper foil generation process, the insulation shielding rubber tape can influence the current density, and the opposite density adjustment is correspondingly realized. According to the method for adjusting the surface density of the high-tensile-resistance copper foil, the shielding effect of the insulating shielding rubber tape and the surface density of the corresponding position are utilized, so that the fine adjustmentof the current size is realized, the difference between the liquid inlet flow and the speed of a liquid inlet hole is ensured, the lateral surface density of the foil surface is more uniform in the copper foil production process, the poor appearance of the copper foil caused by the flow difference of the liquid inlet hole is reduced, and the purpose of improving the tensile strength of the copperfoil is achieved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a method for adjusting the areal density of high tensile copper foil. Background technique [0002] In the field of high-tensile electrolytic copper foil, the uniformity of surface density has a great influence on the tensile strength of copper foil. If there is local unevenness, the tensile strength of copper foil will be weak due to uneven surface density. Points are reduced, which will ultimately affect the promotion of large-scale production of high-tensile copper foil. During the production process of electrolytic copper foil, the electrolyte enters the electrolytic cell formed by the anode plate through the liquid inlet hole. Although the flow rate and liquid inlet speed of each liquid inlet hole are set to be equal, there are always slight differences, because this The existence of the difference causes the difference in the surface density in the transve...

AI Technical Summary

Problems solved by technology

[0002] In the field of high-tensile electrolytic copper foil, the uniformity of surface density has a great influence on the tensile strength of copper foil. If there is local unevenness, the tensile strength of copper foil will be weak due to uneven surface density. Points are reduced, which will ultimately affect the promotion of large-scale production of high-tensile copper foil

During the production process of electrolytic copper foil, the electrolyte enters the electrolytic cell formed by the anode plate through the liquid inlet hole. Although the flow rate and liquid inlet speed of each liquid inlet hole are set to be equal, there are always slight differences, because this Due to the existence of the difference, there is a difference in the lateral surface density in the process of forming the copper foil, which is easy to cause poor appearance. In view of the above problems, it is necessary to make reasonable improvements to the existing technology

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