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Capacitor chip and method for manufacturing same

A technology of capacitors and chips, which is applied in the direction of capacitors, capacitor electrodes, electrolytic capacitors, etc., can solve the problems of the total thickness limitation of stacked capacitor elements, the appearance of pinholes of capacitor elements and poor appearance of bonding wires, etc., and achieve the effect of high electrostatic capacitance

Active Publication Date: 2012-12-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that if the total thickness of the laminated capacitor elements is increased, the capacitor elements are exposed from the encapsulation resin, and appearance defects such as pinholes and bonding wires appear in the encapsulation resin surrounding the capacitor chip are likely to occur. The total amount of thickness of the capacitor element is limited

Method used

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  • Capacitor chip and method for manufacturing same
  • Capacitor chip and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Aluminum chemical conversion foil (thickness 100um) was cut into 3 mm in the short axis direction x 10 mm in the long axis direction, and a polyimide solution with a width of 1 mm was coated on both sides in a surrounding shape and dried so that the long axis direction It is divided into 4mm sections and 5mm sections, thereby making a masking layer. A voltage of 4 V was applied to a 3 mm x 4 mm portion of the chemical conversion foil in a 10% by mass ammonium adipate aqueous solution, and chemical conversion was performed on the cut portion to form a dielectric oxide film. Next, a 3 mm x 4 mm portion of the aluminum foil was immersed in an isopropyl alcohol (IPA) solution containing 25% by mass of 3,4-ethylenedioxythiophene for 10 seconds, and dried at room temperature for 10 minutes. , and immersed for 10 seconds in a 1 mol / L ammonium persulfate aqueous solution adjusted to 0.05% by mass of 2-anthraquinone sodium sulfonate. Next, this aluminum foil was left to stand a...

Embodiment 2

[0069] The capacitor element with a thickness of 0.25 mm produced in Example 1 was stacked on the upper surface of a metal lead frame with a thickness of 0.1 mm, and two sheets were laminated on the lower surface to produce a capacitor element with a thickness of 1.35 mm including the lead frame. Multilayer capacitor components.

[0070] The same method as in Example 1 was used except that the distance from the upper surface of the laminate to the upper surface of the encapsulating resin was 0.15 mm, and the distance from the lower surface of the laminate to the lower surface of the encapsulating resin excluding the adhesive pad was 0.2 mm. In the same way, 100 capacitor chips with a height of 1.7mm except the bonding pads were produced. In addition, by the same method as in Example 1, an appearance inspection and a measurement of capacitor characteristics were implemented. The results are shown in Table 1 and Table 2.

Embodiment 3

[0072] The capacitor element with a thickness of 0.25 mm produced in Example 1 was stacked on the upper surface of a metal lead frame with a thickness of 0.1 mm, and two sheets were laminated on the lower surface to produce a capacitor element with a thickness of 1.1 mm including the lead frame. Multilayer capacitor components.

[0073] The same method as in Example 1 was used except that the distance from the upper surface of the laminate to the upper surface of the encapsulating resin was 0.3 mm, and the distance from the lower surface of the laminate to the lower surface of the encapsulating resin excluding the adhesive pad was 0.3 mm. In the same way, 100 capacitor chips with a height of 1.7mm except the bonding pads were produced. In addition, by the same method as in Example 1, an appearance inspection and a measurement of capacitor characteristics were implemented. The results are shown in Table 1 and Table 2.

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Abstract

Provided are a capacitor chip and a solid electrolytic capacitor wherein one or more capacitor elements are laminated on a metal lead frame which is provided for taking out electricity to the outside of the capacitor chip, the capacitor elements are sealed with a resin, and the laminated body is arranged within a fixed range. The allowable range of the total thickness of the laminated capacitor elements is widened and the capacitance is increased without causing appearance failure of the laminated solid electrolytic capacitor.

Description

[0001] References to related applications [0002] This application is made pursuant to 35 U.S.C. § 119(e)(1) to U.S. Provisional Application No. 60 filed on December 21, 2005 pursuant to 35 U.S.C. § 111(b) / 752,045 filing date for an application claiming priority under Section 111(a) of Title 35 of the Code. technical field [0003] The present invention relates to a capacitor chip and its manufacturing method, in particular to a laminated solid electrolytic capacitor and its manufacturing method. Background technique [0004] In recent years, with the digitalization of electrical equipment and the miniaturization and speed-up of electronic equipment such as personal computers, capacitors with small and large capacitance are required, and capacitors with low impedance are required in the high-frequency field. Recently, a solid electrolytic capacitor using a conductive polymer having electron conductivity as a solid electrolyte has been proposed. In particular, products wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/04H01G9/048H01G9/00H01G9/15
Inventor 小林贤起驹泽荣二歌代智也
Owner MURATA MFG CO LTD
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