A method for adjusting the areal density of high tensile copper foil

Abstract

The invention discloses a method for adjusting the surface density of high-tensile copper foil, comprising the following steps: obtaining the surface density value of the lateral position of the copper foil, drawing a surface density curve, performing smoothing processing, and correspondingly cutting according to the smoothed surface density curve Produce an insulating shielding tape whose edge coincides with the obtained smooth curve, and stick the insulating shielding tape on the anode plate in the axial direction. During the next generation of copper foil, the insulating shielding tape will affect the current density, and the corresponding Realize the adjustment of surface density. The method for adjusting the surface density of high-tensile copper foil of the present invention realizes fine-tuning of the current by using the shielding effect of the insulating tape and the surface density of the corresponding position, thereby ensuring that there are differences in the flow rate and speed of the liquid in the liquid inlet hole Under normal circumstances, during the production process of the copper foil, the surface density of the foil surface is more uniform in the transverse direction, which reduces the poor appearance of the copper foil caused by the difference in the flow rate of the liquid inlet hole, and thus achieves the purpose of improving the tensile strength of the copper foil.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a method for adjusting the areal density of high tensile copper foil. Background technique [0002] In the field of high-tensile electrolytic copper foil, the uniformity of surface density has a great influence on the tensile strength of copper foil. If there is local unevenness, the tensile strength of copper foil will be weak due to uneven surface density. Points are reduced, which will ultimately affect the promotion of large-scale production of high-tensile copper foil. During the production process of electrolytic copper foil, the electrolyte enters the electrolytic cell formed by the anode plate through the liquid inlet hole. Although the flow rate and liquid inlet speed of each liquid inlet hole are set to be equal, there are always slight differences, because this The existence of the difference causes the difference in the surface density in the transve...

AI Technical Summary

Problems solved by technology

[0002] In the field of high-tensile electrolytic copper foil, the uniformity of surface density has a great influence on the tensile strength of copper foil. If there is local unevenness, the tensile strength of copper foil will be weak due to uneven surface density. Points are reduced, which will ultimately affect the promotion of large-scale production of high-tensile copper foil

During the production process of electrolytic copper foil, the electrolyte enters the electrolytic cell formed by the anode plate through the liquid inlet hole. Although the flow rate and liquid inlet speed of each liquid inlet hole are set to be equal, there are always slight differences, because this Due to the existence of the difference, there is a difference in the lateral surface density in the process of forming the copper foil, which is easy to cause poor appearance. In view of the above problems, it is necessary to make reasonable improvements to the existing technology

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