Probe card, preparation method and chip testing method

Abstract

The embodiment of the invention discloses a probe card, a preparation method and a chip testing method. The probe card comprises a substrate and a patterned substrate layer located on one side of thesubstrate. The patterned substrate layer comprises at least one vacant groove and at least one cantilever probe located on the side, away from the substrate, of the patterned substrate layer. The cantilever probe extends to the vacant groove and is suspended on the vacant groove. The cantilever probe comprises a first thermal deformation layer, a second thermal deformation layer and a conductive contact. The first thermal deformation layer is located between the patterned substrate layer and the second thermal deformation layer, the thermal expansion coefficient of the first thermal deformation layer is larger than that of the second thermal deformation layer, the conductive contact is arranged at the end, suspended in the vacant groove, of the cantilever probe, the first thermal deformation layer and / or the second thermal deformation layer are / is a conductive layer, and the conductive layer is electrically connected with the conductive contact. The cantilever probe card solves the problems that an existing probe card is insufficient in butt joint precision and prone to poor contact, automatic contact of the probe is achieved, and effective contact between the cantilever probe anda chip to be detected can be guaranteed.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a probe card, a preparation method and a chip testing method. Background technique [0002] Various tests are required at various stages of semiconductor device manufacturing. For example, in order to test the electrical characteristics of the semiconductor device before packaging the semiconductor device, a test instrument can be used as an interface connected to the semiconductor device through a probe card that includes fine probes. Specifically, the probes of the probe card can be connected to the semiconductor device. The upper electrode contacts are electrically connected so that an electrical signal can be transmitted from the tester to the semiconductor device, and a signal output from the semiconductor device in response to the transmitted electrical signal is detected and analyzed to determine whether the semiconductor d...

AI Technical Summary

Problems solved by technology

[0003] However, with the increase in the number of electrodes in semiconductor chips and further miniaturization, the pitch between electrodes continues to decrease. Especially for Micro-LED chips, the electrodes have small size, complex surface structure, and ups and downs. Traditional probes use It is difficult to ensure the accuracy of mechanical movement in contact with the chip electrodes, which makes it difficult to align the probes during the test, thus affecting the test efficiency

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