Unlock instant, AI-driven research and patent intelligence for your innovation.

Plasma chamber and substrate carrier device thereof

A technology of substrate bearing and plasma cavity, applied in metal material coating process, coating, gaseous chemical plating and other directions, can solve the problems affecting the reliability of OLED display panel, uneven thickness, etc., to improve heat transfer performance, The effect of uniform temperature field distribution and improved uniformity

Active Publication Date: 2021-11-30
YUNGU GUAN TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the film layer formed by the actual process often has the problem of uneven thickness, which affects the reliability of the OLED display panel.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plasma chamber and substrate carrier device thereof
  • Plasma chamber and substrate carrier device thereof
  • Plasma chamber and substrate carrier device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052]Through research on the film-forming process in the background technology, the inventor found that one reason for the uneven film-forming thickness is that the material of the lifting thimble is different from the heat transfer matrix material of the heating platform, and the thermal conductivity of the former is significantly smaller than that of the latter. After the chip is loaded on the heating platform, the temperature at the lifting thimble is significantly lower than the temperature at the heat transfer substrate. The layer is thinner than other regions.

[0053] If the heat transfer efficiency of the substrate is poor, the problem of uneven film formation is more obvious.

[0054] In view of the above problems, if the waiting time is extended, the temperature will spread evenly, which will result in lower processing efficiency.

[0055] The invention proposes to change the integrated structure of the thimble rod, select a material with a large thermal conductivi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a plasma chamber and a substrate carrying device thereof. The substrate carrying device includes: a heating platform and a plurality of lifting thimbles passing through the heating platform; the heating platform is used to provide heat to the substrate to be processed; The plurality of lifting pins are used to lift the substrate from the heating platform or drop the substrate onto the heating platform; wherein, the heating platform includes a heat transfer base, and the lifting pins include thimbles The rod and the thimble cap, the thermal conductivity of the thimble cap is greater than the thermal conductivity of the thimble shaft, and the thermal conductivity of the thimble cap is greater than or equal to or less than the thermal conductivity of the heat transfer matrix. The invention can improve the heat transfer performance of the thimble cap in contact with the substrate, and the heat transfer performance of the thimble cap and the heat transfer substrate is close, and can make the temperature field distribution on the upper surface of the heating platform uniform, and then transfer heat to the temperature field on the substrate Uniform distribution improves the uniformity of film formation on the substrate.

Description

technical field [0001] The invention relates to the technical field of plasma processing equipment, in particular to a plasma chamber and a substrate carrying device thereof. Background technique [0002] In recent years, display devices, especially display devices based on organic light emitting diodes (Organic Light Emitting Diode, OLED) have become popular new flat-panel display products at home and abroad. The OLED display panel has the characteristics of self-illumination, wide viewing angle, short response time, high luminous efficiency, wide color gamut, low operating voltage, thin panel, large size, flexible panel, and simple manufacturing process. cost potential. [0003] An OLED device mainly includes an anode, an organic light-emitting layer and a cathode that are stacked. The light emission of the OLED device applies a driving voltage to the anode through the transistor in the pixel driving circuit to form a voltage difference between the anode and the cathode....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/458C23C16/46C23C16/513
CPCC23C16/4581C23C16/46C23C16/513
Inventor 梁鹏赖善春王燕锋刘成
Owner YUNGU GUAN TECH CO LTD