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Electroplating solution for copper electroplating and electroplating process

An electroplating process and electroplating solution technology, which is applied in the field of electroplating solution, can solve the problems of high hidden dangers of safety accidents, and achieve the effects of safe accidents, less accidents, and low internal stress

Inactive Publication Date: 2019-07-26
佛山市诺诚科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the existing decorative electroplating copper layer adopts a sulfuric acid electroplating copper process, which needs to be continuously replenished with sulfuric acid during the specific production process, and there is a relatively large potential for safety accidents

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An electroplating solution for electroplating copper, comprising the following components:

[0019] Copper sulfate 200g / L, sulfamic acid 200g / L and sodium chloride 0.2g / L, solvent is water.

[0020] The electroplating process includes the following steps:

[0021] (1) metal copper is put into the above-mentioned electroplating solution as an anode;

[0022] (2) the workpiece is put into the above-mentioned electroplating solution as the cathode;

[0023] (3) Connect the DC power supply for electroplating.

Embodiment 2

[0025] An electroplating solution for electroplating copper, comprising the following components:

[0026] Copper sulfate 180g / L, sulfamic acid 120g / L and sodium chloride salt 0.15g / L, solvent is water.

[0027] The electroplating process includes the following steps:

[0028] (1) metal copper is put into the above-mentioned electroplating solution as an anode;

[0029] (2) the workpiece is put into the above-mentioned electroplating solution as the cathode;

[0030] (3) Connect the DC power supply for electroplating.

Embodiment 3

[0032] An electroplating solution for electroplating copper, comprising the following components:

[0033] Copper sulfate 210g / L, sulfamic acid 250g / L and potassium chloride 0.21g / L, solvent is water.

[0034] The electroplating process includes the following steps:

[0035] (1) metal copper is put into the above-mentioned electroplating solution as an anode;

[0036] (2) the workpiece is put into the above-mentioned electroplating solution as the cathode;

[0037] (3) Connect the DC power supply for electroplating.

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PUM

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Abstract

The invention provides an electroplating solution for copper electroplating and an electroplating process. The electroplating solution comprises the following components of 180-220g / L of main salt, 120-250g / L of amino sulfonic acid and 0.15g-0.25g / L of conductive salt, and a solvent is water. The electroplating process comprises the following steps that (1) metal copper is put into the electroplating solution as an anode; (2) a workpiece is put into the electroplating solution as a cathode; and (3) a direct-current power supply is connected for electroplating. Inner stress of a copper electroplated layer obtained through electroplating by utilizing the electroplating solution is low, the electroplating requirements of electronic products are met, safety is achieved, and accidents are not prone to occurring.

Description

technical field [0001] The invention belongs to the technical field of electroplating solution, and in particular relates to an electroplating solution and an electroplating process for copper electroplating. Background technique [0002] With the development of industrialization, the problem of environmental pollution is becoming more and more serious. For the protection of the environment, clean, environmentally friendly and energy-saving production has attracted more and more attention from the industry. In the cyanide copper plating process of the electroplating industry, the production process must use the cyanide cyanide copper plating process. There are highly toxic cyanides, which pollute the environment extremely seriously and pose a serious threat to the health of workers; as people's environmental protection With the enhancement of awareness, it is urgent to develop an environmentally friendly and clean copper plating process to replace the traditional cyanide cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 周建中
Owner 佛山市诺诚科技有限公司
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