Film Thickness Measuring Method of Ink Material

Abstract

The invention relates to a method for measuring the film thickness of an ink material, comprising the following steps: filling various types of ink materials layer by layer in pixel pits of a glass substrate to make a measurement substrate; On the basis of the pixel pits of one layer of material, at least one pixel pit is not filled with the ink material of the next layer; in each layer of pixel pits filled with ink material, at least one exposed pixel pit of the layer of ink material is selected as the The measurement point of the layer ink material; measure each measurement point on the measurement substrate, detect the thickness parameters measured by each measurement point, and calculate the film thickness of each type of ink material according to the thickness parameters. The above method can realize the measurement of the film thickness of various ink materials on one measurement substrate, and solve the problem of low measurement efficiency caused by the need to separately prepare multiple measurement substrates when measuring the film thickness of various ink materials in the prior art. The efficiency of ink material film degree measurement is improved.

Description

technical field [0001] The invention relates to the technical field of device preparation, in particular to a method for measuring the film thickness of an ink material. Background technique [0002] Organic Light-Emitting Diode (OLED) devices have been widely used in display devices. In the manufacturing process of OLED devices, some functional materials in OLED devices can be prepared by inkjet printing or evaporation process, such as hole injection layer (Hole Injection Layer, HIL), hole transport layer (Hole Transport Layer, HTL) And Emissive Layer (EML). That is, in the known pixel pits, the functional layer material ink is filled into the pixel pits on the glass substrate by means of inkjet printing or vapor deposition. [0003] The accuracy of the film thickness and the uniformity of the film thickness of the ink material filled in the pixel pit are important inspection points of the process. Taking the inkjet printing process as an example, before making an OLED d...

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Problems solved by technology

[0004] At present, when measuring the film thickness of the ink material, there is such a problem in the production of the substrate to be tested: different ink material measurements need to prepare different glass substrates, and the preparation of a device is in the process of inkjet printing or evaporation. It is often necessary to use a variety of ink materials to measure the film thickness of various ink materials. If the measurement substrate is prepared for each ink material for measurement, it will take a lot of time, resulting in the ink material before device preparation. The efficiency of film thickness measurement is low, which in turn affects the production efficiency of OLED devices

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