Coupling alignment device and method of laser chip and silicon-based photoelectric chip

Abstract

The invention discloses a coupling alignment device and method of a laser chip and a silicon-based photoelectric chip. The device comprises a connection plate, wherein the connection plate comprises abody, a first connection part and a second connection part, the first connection part is connected with the laser chip, and the second connection part is connected with the silicon-based photoelectric chip. The method comprises the steps of accurately determining a depth of a to-be-formed groove by a stop layer in the technological process of the laser chip and the silicon-based photoelectric chip according to position information of a waveguide, etching a first groove in the laser chip, and etching a second groove in the silicon-based photoelectric hip; and forming a first bulge and a secondbulge on the connection plate, assembling the laser chip onto the connection plate, and assembling the connection plate onto the silicon-based photoelectric chip. On the basis of precision micronanoprocessing technology, the accurate alignment of the laser chip and the silicon-based photoelectric chip is ensured, the problems of subsequent energization and cooling are not needed to be considered, and the difficulty of the package process is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of silicon-based optoelectronic device packaging, more specifically, the invention relates to a coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip. Background technique [0002] Silicon is an indirect bandgap semiconductor, and its luminous efficiency is not high. Therefore, silicon has always been considered unsuitable for making light source materials. Therefore, for silicon-based optoelectronic technology, the introduction of light sources has become a very important task. [0003] At present, the light source introduction method of silicon-based optoelectronic technology is generally: directly mount the light source on the silicon-based optoelectronic chip, generally mount the laser chip directly on the silicon-based optoelectronic chip by flip chip (Flip chip), and then The waveguide of the laser chip and the waveguide of the silicon-based optoelectronic chip a...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low efficiency, low precision, and high cost of coupling alignment between laser chips and silicon-based optoelectronic chips in the prior art, the present invention innovatively provides a coupling alignment device and method for laser chips and silicon-based optoelectronic chips , based on the design of the adapter plate structure and the improvement of the connection structure, the present invention can complete the coupling and alignment work of the laser chip and the silicon-based optoelectronic chip with high efficiency, high precision and low cost, and the present invention significantly reduces the difficulty of processing technology, Thereby better solving many problems existing in the prior art

Images