Antenna packaging structure and packaging method
An encapsulation method and encapsulation structure technology, which are applied to antenna support/installation device, antenna grounding switch structure connection, and antenna array manufacturing device, etc., can solve the problems of large size of antenna package and large signal transmission loss, and reduce the package size. The effect of size, improved adhesion performance, and improved mechanical structure strength
Pending Publication Date: 2019-08-02
SJ SEMICON JIANGYIN CORP
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Problems solved by technology
[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems of large antenna packaging volume and large signal transmission loss in the prior art
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[0049] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0050] For example, when describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the protection scope of the present invention. In addition, the three-dimensional space dimensions of length, width and depth sho...
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The invention provides an antenna packaging structure and a packaging method. The structure comprises a re-wiring layer, metal feeder columns, a first packaging layer, a first antenna metal layer, a protective adhesion layer, a second packaging layer, a second antenna metal layer, at least one antenna circuit chip, a third packaging layer and metal bumps, wherein the metal feeder columns are formed on the second surface of the re-wiring layer; the first packaging layer coats the metal feeder columns; the first antenna metal layer is connected with the metal feeder columns; the protective adhesion layer covers the first antenna metal layer; the at least one antenna circuit chip is electrically bonded to the first surface of the re-wiring layer; the third packaging layer at least surrounds the periphery of the antenna circuit chip; and the metal bumps realizes the electrical extraction of the re-wiring layer. The antenna packaging structure can integrate all active assemblies or passiveassemblies into one packaging structure through different circuit arrangement of the re-wiring layer, and can effectively reduce the packaging size. The structure provided by the invention is a vertical arrangement structure, so that the conduction path between assemblies can be effectively shortened, thereby having better electrical property and antenna efficiency, and being lower in power consumption at the same time.
Description
technical field [0001] The invention belongs to the field of packaging and the field of communication equipment, and in particular relates to an antenna packaging structure and a packaging method. Background technique [0002] Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Th...
Claims
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Login to View More IPC IPC(8): H01Q1/22H01Q1/38H01Q1/50H01Q21/00H01L23/66
CPCH01Q1/2283H01Q1/38H01Q1/50H01Q21/0087H01L23/66
Inventor 陈彦亨林正忠吴政达
Owner SJ SEMICON JIANGYIN CORP