Method for manufacturing semiconductor devices
A manufacturing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as separation, and achieve the effect of improving adhesion, reliability and life
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[0037] figure 1 is a flowchart of the manufacturing method 10 of the semiconductor device 11 . The manufacturing method 10 includes the following steps: a wafer manufacturing process 1, a backside polishing process 2, an electrical property measurement process 3, a cutting process 4, a lead frame cleaning process 5, a lead frame mounting process 6, a chip back cleaning process 7, and resin sealing Process 8. Perform the above process in the order shown in the figure.
[0038] In the wafer manufacturing process 1, a 0.2-0.3mm thick oxide film (SiO 2 ) covering a flat silicon wafer 17 ( figure 2 ) on the upper surface; and the circuit patterns of the active circuits thereon are exposed and developed. The oxide layer is then etched into the circuit pattern. Thereafter, an infinite number of active circuits 171 are formed on the surface by doping the exposed surface of the wafer 17 (see image 3 ).
[0039] In the backside polishing process 2, the surface (backside) of the...
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