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OLED package structure, OLED package method and display device

A packaging structure and device technology, applied in the direction of semiconductor devices, electrical solid devices, organic semiconductor devices, etc., can solve problems affecting production yield, device dark lines, affecting electrical properties, etc., to improve yield and competitiveness, box thickness Uniform, crush-resistant effect

Active Publication Date: 2019-08-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the spherical spacer 7 is mostly silicon or silicide with a relatively hard texture, it is easy to cause damage to the exposed metal wires 8 on the display substrate 1, especially the metal wires 8 overlapping up and down during the packaging and pressing process. Pressure damage, or contact with the electrode will affect the electrical properties, resulting in dark lines and other undesirable phenomena in the device, which affects the yield of production

Method used

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  • OLED package structure, OLED package method and display device
  • OLED package structure, OLED package method and display device
  • OLED package structure, OLED package method and display device

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Embodiment 1

[0032] Such as Figure 2-Figure 4 As shown, Embodiment 1 of the present invention proposes an OLED packaging structure for packaging the OLED device 2 on the display substrate 1. The OLED packaging structure includes:

[0033] Encapsulation cover plate 3, the first surface edge of the package cover plate 3 opposite to the display substrate 1 is surrounded by a sealant layer 4, and the area surrounded by the sealant layer 4 is filled with a filler layer 5;

[0034] Wherein, a plurality of support blocks 6 with preset flexibility are distributed in the region corresponding to the sealant layer 4 , and the support blocks are used to fix the thickness of the box between the packaging cover plate and the display substrate.

[0035] Specifically, the existing OLED encapsulation methods mostly use the encapsulation cover plate 3 for encapsulation, the encapsulation cover plate is arranged on the upper side of the display substrate 1, the OLED device is arranged on the surface of the ...

Embodiment 2

[0044] Such as Figure 5 As shown, Embodiment 2 of the present invention proposes an OLED encapsulation method, the OLED encapsulation method comprising:

[0045] S1: making the support block 6, and arranging the support block 6 on the edge of the first surface of the packaging cover plate 3;

[0046] S2: Coating a sealant layer 4 around the edge of the first surface of the packaging cover plate 3;

[0047] S3: coating the filling glue layer 5 in the area surrounded by the sealing glue layer 4;

[0048] S4: Pressing the packaging cover plate 3 and the display substrate 2, and curing the sealing glue layer 4 and the filling glue layer 5.

[0049] Embodiment 2 of the present invention proposes an OLED encapsulation method. By setting a plurality of support blocks at the edge of the encapsulation cover plate corresponding to the encapsulation adhesive layer, the box thickness can be fixed during the process of laminating the encapsulation cover plate and the display substrate. ...

Embodiment 3

[0052] Embodiment 3 of the present invention provides a display device, which includes: the above-mentioned OLED encapsulation structure.

[0053] Embodiment 3 of the present invention proposes a display device. By arranging a plurality of support blocks at the edge of the packaging cover corresponding to the packaging adhesive layer of the packaging structure, it can act as a fixing box during the process of pressing the packaging cover and the display substrate. thickness, to ensure uniform thickness of the box, especially for large-sized display devices, the effect is more obvious. Due to the preset flexibility of the support block, excessive pressure will not be exerted on the display substrate during the pressing process of the package cover plate and the display substrate, which can prevent the crushing of the exposed wires or affect the electrical properties after contacting the electrodes. It can improve the display image quality of the display device, and can improve ...

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Abstract

The invention discloses an OLED package structure, an OLED package method and a display device, relates to the technical field of display, and achieves the purpose that the display performances of theOLED device are not influenced while the box thicknesses of the package structure are uniformed between a display substrate and a package cover plate. The OLED package structure comprises a package cover plate, a sealing frame glue layer is arranged on the edge of the first surface, opposite to the display substrate, of the package substrate in a surrounding mode, a region encircled by the sealing frame glue layer is filled with a filling adhesive layer, a plurality of support blocks with the preset flexibility are distributed in the region corresponding to the sealing frame glue layer, and the thicknesses of the support blocks are equal to the preset distance between the package cover plate and the display substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging structure, a packaging method and a display device. Background technique [0002] OLED is a display lighting technology that has gradually developed in recent years, especially in the display industry. Due to its advantages of high response, high contrast, and flexibility, it is considered to have broad application prospects. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device. [0003] Currently commonly used OLED encapsulation methods include sheet encapsulation, glass encapsulation, dam filling encapsulation, and the like. Among them, the dam-type filling packaging, that is, the packaging of the device is completed by using the sealing glue (Dam) and the filling glue (Fill), because it has a good effect of blocking water a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/841H10K50/8426H10K50/8428H10K71/00H10K2102/351
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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