Exploding foil integrated chip comprising energetic flyer
A technology of integrated chips and explosive foils, applied in the field of miniature low-energy ignition or detonation devices, can solve the problems of limited weapon systems, achieve the effects of reducing preparation costs, reducing ignition energy, and enhancing ignition or detonation effects
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[0031] In this implementation case, an explosive foil detonation system is designed on the basis of the explosive foil integrated chip unit, combined with image 3 and Figure 4, including the following steps NOTE: image 3 The left and right pictures in a-3f are the front view and top view of the manufacturing process, respectively:
[0032] first step, see image 3 a, for 50.8mm long x 50.8mm wide x 0.86mm high Al 2 o 3 The surface of the ceramic substrate 1 is cleaned.
[0033] The second step, see image 3 b, Al metal layer is deposited on the surface of ceramic base substrate 1 by photolithography, lift-off process and magnetron sputtering process to form pad 2, transition region 3 and bridge foil 4. The relevant dimensions are: the width of pad 2 is 7.5mm; the distance from bridge foil 4 to pad 2 is about 5mm; the size of bridge foil is 0.3mm×0.3mm×3.6μm; The transition area 3 is connected; in order to facilitate welding and conduction, a 100nm Au layer is deposited...
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