Shower head, shower unit, coolant supply method, and wafer grinding method

Abstract

The invention provides a spray head, a spray assembly, a coolant supply method and a wafer grinding method. The spray head is used for spraying liquid to a grinding wheel and comprises a nozzle and two isolating components. The nozzle is internally provided with a channel used for allowing liquid to circulate therein. The isolating components are arranged at the two sides of the outlet end of thenozzle correspondingly. A first end of each isolating component is connected with the nozzle, and a second end of each isolating component protrudes out of the outer edge of the outlet end of the nozzle and used for stopping air from forming an air layer on the surface of the grinding wheel when the grinding wheel rotates. By means of the spray head, the air can be isolated effectively; and the great amount of air is prevented from being in contact with coolant, and the air layer is formed on the surface of the grinding wheel, so that the surface of a wafer can be continuously ground, and thequality of the wafer is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a shower head, a shower assembly, a coolant supply method and a wafer grinding method. Background technique [0002] Usually, when the edge of the wafer after wire cutting is observed under a microscope, it will be found that there are tiny debris on the edge of the silicon wafer, which is relatively sharp. When this type of wafer is subjected to the next process, the edge debris will easily cause cracks and break etc. In addition, the outer diameter of the ingot before wire cutting is usually larger than the outer diameter of the final processed wafer, and the outer diameter difference is about 0.5-1.0 mm. Therefore, it is necessary to grind the edge of the wafer after wire cutting. When grinding the edge of the wafer, use A grinding wheel with a certain grain size grinds the edge of the wafer to remove damage or chipping on the surface of the wafer, and processes it to ...

AI Technical Summary

Problems solved by technology

However, during grinding, the number of rotations per minute of the grinding wheel can reach 7000-9000rpm, and the coolant supplied at 3-5 liter / min per minute is difficult to be accurately sprayed to the designated position to achieve the purpose of cooling, lubrication and cleaning. Not only that, Aquaplaning occurs near the high-speed rotating grinding wheel. When air and coolant flow into the gap between the grinding wheel and the wafer at the same time, an air layer will be formed on the surface of the grinding wheel, which will hinder cooling and lubrication. Non-wet continuous grinding and intermittent grinding of wet and dry grinding appear instantaneously on the surface of the wafer edge, resulting in debris or deterioration of the roughness of the wafer grinding surface, which in turn affects the life of the grinding wheel

[0004] In addition, even by increasing the amount of coolant used, thereby increasing the amount of coolant scattered around the contact position between the grinding wheel and the wafer, the scattered coolant is likely to cause internal contamination of the equipment and contamination of the unused grinding wheel pocket

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