Packaging method and device for high-thermal-conductivity and high-temperature-resistance heat absorbentfor logging instrument

Abstract

The invention belongs to the relative fields of logging technologies, and discloses a packaging method and device for a high-thermal-conductivity and high-temperature-resistance heat absorbent for a logging instrument. The method comprises the steps of mixing molten paraffin wax and expanded graphite, and carrying out magnetic stirring and ultrasonic treatment on the mixture to obtain a needed molten-state composite heat absorbent material; drilling a pouring hole in an end cover or a shell of a heat absorbent container, and then injecting the molten-state composite heat absorbent material into the heat absorbent container through the pouring hole, wherein the pouring hole penetrates through the end cover or the shell; and inserting a sealing pin into the pouring hole to execute tight fitsealing, and finally going on to execute welding sealing on an interval in fit. The invention further discloses a corresponding product. With the packaging method and device for the high-thermal-conductivity and high-temperature-resistance heat absorbent for the logging instrument, and the corresponding product, a heat absorbent module with the high conductivity, the high reliability and the highresistance to high temperatures can be obtained; and compared with the prior art, the technical problems that in the prior art, a heat absorbent module is poor in heat conductivity and cannot be usedin a high-temperature environment for a long time, and so on can be effectively solved.

Description

technical field [0001] The invention belongs to the related field of well logging technology, and more specifically, relates to a heat-absorbing agent packaging method and equipment for a logging instrument with high thermal conductivity and high temperature resistance. Background technique [0002] Well logging instruments are mainly used in underground or subsea oil exploration and development. Because logging tools work on the seabed or in the range of hundreds of meters to thousands of meters underground, they are often faced with harsh environments of high temperature and high pressure. The high temperature external environment will seriously affect the life and reliability of the electronic devices in the logging tool, so the current logging tool mostly uses devices such as thermos bottles to protect them from heat. The thermos bottle often includes a vacuum bottle body, an insulating plug at the mouth of the bottle, and a heat-absorbing agent module located in the va...

AI Technical Summary

Problems solved by technology

The thermos bottle often includes a vacuum bottle body, an insulating plug at the mouth of the bottle, and a heat-absorbing agent module located in the vacuum bottle, etc., wherein the vacuum bottle body is used to prevent the heat from the high-temperature environment from flowing in from the circumference of the bottle body, and the heat-insulating plug is used to prevent heat It flows into the thermos bottle from the mouth of the vacuum bottle, but the above two measures can only reduce the impact of the external high temperature environment on the electronic devices of the logging instrument, and cannot solve the temperature rise caused by the self-heating of the electronic devices in the thermos bottle, so it mainly depends on the suction Thermal agent module to realize self-heating absorption function for electronic devices inside the thermos bottle

[0003] However, further studies have shown that the heat-absorbing agent modules in the prior art usually have technical problems such as low thermal conductivity, inability to withstand high temperatures, and low reliability.

Specifically, on the one hand, many current endothermic modules mostly use hydrated salt materials, which are not suitable for high temperature environments above 100°C, because hydrated salts will vaporize at 100°C and the internal pressure of the endothermic module There is a risk of explosion; on the other hand, most of the current common heat absorber modules are packaged in stainless steel with low thermal conductivity, and the thermal conductivity of the heat absorber is also low, resulting in low thermal conductivity of the heat absorber module as a whole , slow heat absorption and release speed and other technical problems

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