Manufacturing method of flexible substrate and flexible packaging structure

A flexible substrate and manufacturing method technology, which is applied in the manufacture of semiconductor/solid-state devices, printed circuits connected with non-printed electrical components, electrical components, etc. It can well meet the requirements of system integration and the difficulty of process control, so as to reduce the risk of line interconnection breakage, improve the reliability of fixing, and facilitate the overall packaging.

Inactive Publication Date: 2019-08-23
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process, it is mainly based on PI materials such as lithography and other technologies, which cannot well meet the requirements of system integration in the emerging flexible electronics technology field, such as: manufacturing costs, flexible ductility, integrated manufacturing processes, etc.
Some enterprises or scientific research institutions have begun to study the printing process based on PET and other materials, but the manufacturing line accuracy and line width cannot meet the requirements of complex system-level packaging substrates
Using conventional printing technology, there are constant difficulties and many problems in process control for the requirements of low thin line width, high conductivity and good shape flatness.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of flexible substrate and flexible packaging structure
  • Manufacturing method of flexible substrate and flexible packaging structure
  • Manufacturing method of flexible substrate and flexible packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] In order to further explain the technical means and functions adopted by the present invention to achieve the intended invention purpose, the detailed description is as follows in conjunction with the accompanying drawings and preferred embodiments.

[0034] The invention provides a method for manufacturing a flexible substrate and a flexible packaging structure with the flexible substrate. The flexible substrate can better meet the requirements of the flexible packaging structure for the flexible substrate, and at the same time can control the layout of the connecting lines more accurately.

[0035] figure 1 The cross-sectional structure intention of the flexible substrate provided for the first embodiment of the present invention, such as figure 1 As shown, the flexible substrate provided by the first embodiment of the present invention includes a flexible substrate 10, and a first groove 20 is formed on the flexible substrate 10 (see Figure 6B ), the connecting ci...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a manufacturing method of a flexible substrate, and the method comprises the following steps: providing the flexible substrate; manufacturing a first groove on the flexible substrate; manufacturing a connecting circuit in the first groove; and manufacturing a dielectric insulating layer on the connecting circuit. The flexible substrate manufactured by adopting the manufacturing method of the flexible substrate can better meet the requirements of a flexible packaging structure on the flexible substrate, and meanwhile, the layout of a connecting circuit can be accurately controlled.

Description

[0001] This application is a divisional application for an invention patent with an application date of February 14, 2018, an application number of 201810151646.8, and a patent titled "Flexible Substrate, Manufacturing Method, and Flexible Packaging Structure". technical field [0002] The invention relates to the field of semiconductor system-level packaging, in particular to a method for manufacturing a flexible substrate and a flexible packaging structure. Background technique [0003] In recent years, wearable devices have become more and more popular, and wearable devices have been used more and more in fields such as soldiers' field operations or training, athlete training, physical fitness monitoring of exercisers, and health monitoring. In order to collect information more accurately, how to make wearable devices flexible so that they can be closer to the curve of the human body itself has become the focus of major manufacturers and laboratories. The flexibility of w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498H05K1/18
CPCH01L21/4846H01L23/49838H05K1/185
Inventor 龚云平汪洋刘洪
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap