Package pressure alarm control system based on ceramic substrate table

Abstract

The invention discloses a package pressure alarm control system based on a ceramic substrate table. The system comprises a control processing subsystem, and a group consisting of a data acquisition subsystem, a safety early warning subsystem, an execution output subsystem and an output feedback subsystem which are connected to the control processing subsystem. The input end of the output feedbacksubsystem is connected with the execution output subsystem. The control processing system is used for processing data and transmitting a control instruction. The data acquisition subsystem is used foraccurately obtaining the package pressure information. The safety early warning subsystem is used for giving an alarm indicating that the current package pressure exceeds the safe pressure. The execution output subsystem is used for adjusting the package pressure according to the control instruction of the control processing subsystem. The output feedback subsystem is used for returning the rateat which the execution output subsystem adjusts the package pressure. The package pressure alarm control system is reasonable in structural design, can accurately control package pressure, ensure thenormal assembly of a packaged product, and improves the production quality of the packaged product.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaged air pressure alarm control system based on a ceramic substrate meter. Background technique [0002] Encapsulation, that is, hiding the attributes and implementation details of the object, only exposing the interface to the outside world, and controlling the access level of reading and modifying the attributes in the program; combining the abstracted data and behavior (or function) to form an organic whole, also It is to organically combine the data and the source code that operates the data to form a "class", in which both data and functions are members of the class. In terms of electronics, packaging refers to connecting the circuit pins on the silicon chip to external connectors with wires to connect with other devices. [0003] The current packaging equipment is to fix the chip and sensor on the PCB board, but now based on customer requirements and special p...

AI Technical Summary

Problems solved by technology

[0003] The current packaging equipment is to fix the chip and sensor on the PCB board, but now based on customer requirements and special performance requirements of the product, the product must be resistant to high temperature, so this product must be fixed on the ceramic sheet, and the rubber nozzle pressure is too high during operation. If it is too large or too small, it will cause the product to shift when loading the film, which will cause the air hole to be blocked and cause the pressure sensor to fail. There are certain defects.

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