Packaging air pressure alarm control system based on ceramic substrate meter

Abstract

The invention discloses a packaged air pressure alarm control system based on a ceramic substrate meter, which includes a control processing subsystem, a data acquisition subsystem connected to the control processing subsystem, a safety early warning subsystem, an execution output subsystem, and an output feedback subsystem. And the input end of the output feedback subsystem is connected with the execution output subsystem, the control processing subsystem is used for data processing and the sending of control instructions, the data acquisition subsystem is used for accurately obtaining package air pressure information, and the safety warning subsystem is used for early warning of the current When the packaging air pressure exceeds the safe air pressure, the execution output subsystem is used to adjust the packaging air pressure according to the control command of the control processing subsystem, and the output feedback subsystem is used to feed back the speed of the execution output subsystem to adjust the packaging air pressure. The invention has a reasonable structural design, can accurately control the packaging pressure, ensures the normal assembly of the packaged products, and improves the production quality of the packaged products.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaged air pressure alarm control system based on a ceramic substrate meter. Background technique [0002] Encapsulation, that is, hiding the attributes and implementation details of the object, only exposing the interface to the outside world, and controlling the access level of reading and modifying the attributes in the program; combining the abstracted data and behavior (or function) to form an organic whole, also It is to organically combine the data and the source code that operates the data to form a "class", in which both data and functions are members of the class. In terms of electronics, packaging refers to connecting the circuit pins on the silicon chip to external connectors with wires to connect with other devices. [0003] The current packaging equipment is to fix the chip and sensor on the PCB board, but now based on customer requirements and special p...

AI Technical Summary

Problems solved by technology

[0003] The current packaging equipment is to fix the chip and sensor on the PCB board, but now based on customer requirements and special performance requirements of the product, the product must be resistant to high temperature, so this product must be fixed on the ceramic sheet, and the rubber nozzle pressure is too high during operation. If it is too large or too small, it will cause the product to shift when loading the film, which will cause the air hole to be blocked and cause the pressure sensor to fail. There are certain defects.

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