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Power module and semiconductor device

一种功率模块、半导体的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决封装体损伤、没有提出间隔件构造、基板应力施加等问题，达到可靠性高的效果

Pending Publication Date: 2019-08-23
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no specific configuration of the spacer is proposed
If only the spacer is provided, there remains the problem that excessive stress from the substrate is applied to the end of the package
[0011] As mentioned above, it is necessary to firmly fix the substrate, heat sink, and power module so that the terminals of the power module will not be broken by vibration during use or contact during assembly, but in this case, there are stresses due to substrate warpage and the like. Problems that cause damage to the package

Method used

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  • Power module and semiconductor device
  • Power module and semiconductor device
  • Power module and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] figure 1 It is a cross-sectional view of the semiconductor device 10 according to the first embodiment. The semiconductor device 10 includes a power module 11 . The power module 11 has semiconductor elements such as IGBTs and diodes inside. The semiconductor element is covered with a resin frame 12 . The resin frame body 12 is provided with the main-body part 12a and the protrusion part 12b. The main body portion 12a is a portion covering the semiconductor element. The protruding portion 12b is a portion protruding from the main body portion 12a. The resin frame 12 is a package of the power module 11 . The lead terminal 14 extends from the main body portion 12a to the outside. The lead terminal 14 is electrically connected to the semiconductor element inside the main body portion 12a.

[0039] The protruding portion 12b is in contact with the printed substrate 16 . Specifically, the bottom surface of the protruding portion 12b is, for example, a flat surface. T...

Embodiment approach 2

[0048] Figure 6 It is a side view of the semiconductor device according to Embodiment 2. Two protrusions 12b are provided. The resin frame body 12 is provided with the connection part 12e which protrudes from the main-body part 12a, and connects two protrusion parts 12b. The protrusion amount of the connection part 12e from the main body part 12a can be set to the same degree as the protrusion amount of the protrusion part 12b from the main body part 12a. Figure 7 yes Figure 6 The bottom view of the power module 11. For example, by making the width of the connection part 12e approximately the same as the width of the protrusion part 12b, the area of ​​the connection part 12e will not become too large.

[0049] For example, if the power module has a slim shape, if the power module 11 is screwed to the printed circuit board 16 at two places, the central part of the power module 11 may vibrate and resonate, and the resin frame 12 may be damaged. Therefore, in Embodiment 2...

Embodiment approach 3

[0054] Figure 11 It is a cross-sectional view of the semiconductor device according to Embodiment 3. The resin frame body 12 is equipped with the fin 12g which protrudes from the main-body part 12a in the same direction as the protrusion part 12b. The fins 12g are thin flat plates. A plurality of fins 12g can be provided between two protrusions 12b. Figure 12 yes Figure 11 The cross-sectional view at the line B-B'. The width of the fins 12g can be made approximately the same as the width of the main body portion 12a. According to the semiconductor device according to Embodiment 3, heat can be dissipated not only from the heat sink 30 side but also from the surface of the resin housing 12 .

[0055] Figure 13 It is a figure which shows the modification of a fin. The bottom surface of the fin 12h is a curved surface. The fin 12h is provided between the two protrusions, and the amount of protrusion of the fin 12h from the main body 12a can be maximized on the line con...

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PUM

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Abstract

The purpose of the present invention is to provide a highly reliable power module and a semiconductor device. In the power module and the semiconductor device, a substrate, a radiator and the power module are fixed in a manner that a lead terminal is not broken due to vibration during use or contact during assembly, and the problem that a resin frame body is damaged due to stress such as warping of the substrate can be solved. The power module according to the present invention is provided with: the resin frame body having a main body part and a protruding part protruding from the main body part; and the lead terminal extending from the main body part to the outside. Furthermore, a through hole through which the main body part and the protruding part penetrate is formed.

Description

technical field [0001] The present invention relates to power modules and semiconductor devices. Background technique [0002] For power modules used in inverter drives of small-capacity motors, semiconductor components such as IGBTs (Insulated Gate Bipolar Transistor) and diodes are usually packaged with molded resin, and have DIP (Dual in line) terminal arrangements or External terminals arranged in close proximity to it. When mounting the power module as described above on a substrate, it is necessary to prevent damage such as cracks due to stress applied to the molding resin due to bending and deformation of the substrate during mounting and use after mounting. Specifically, the power module is fixed to the substrate by soldering or the like in a state where the bottom surface of the package of the power module is lifted from the substrate by the stopper portion provided at an appropriate height of the terminal portion. Thereby, the terminal acts like a spring to relie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L25/18
CPCH01L23/3114H01L25/18H05K7/209H01L23/049H01L23/4006H05K7/1427H05K7/2089H01L2023/4087H01L2023/4062H01L2023/4018H01L23/28
Inventor 长原辉明
Owner MITSUBISHI ELECTRIC CORP
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