PCB drying effect monitoring and judgment method

Abstract

A PCB drying effect monitoring and judgment method is used to determine whether the drying effect of the PCB substrate meets the standard. The PCB substrate is a semi -finished product after electroplating and before the film.The transparent PVC cover; (2), remove the PCB substrate of the drying machine, place it on the paved PVC cover, and spread the surface of the PCB board another layer of PVC cover, and the upper and lower layers of PVCThe cover film is tightly exposed to the PCB board; (3), observe the PVC cover, whether there is water vapor gathered in the pores.By adopting the drying effect of the PCB substrate to test the drying effect of the PCB substrate, it is determined whether the drying effect is qualified. The overall testing process does not need to use additional test instruments, and the traditional knocking PCB is used to prevent the PCB damage.Obviously, it has strong promotional significance.

Description

technical field [0001] The invention relates to a PCB manufacturing process, in particular to a method for monitoring and judging PCB drying effects. Background technique [0002] The main component of the dry film is a water-soluble polymer monomer, which is easy to flow in contact with water; when the drying effect of the outer layer is poor, the protective tin cannot be plated, and there will be no copper in the hole after etching. Therefore, the drying effect of pretreatment is very important. At present, the monitoring and judging methods for the drying effect of the inner and outer layers of the PCB industry are: [0003] 1. Lay a piece of white paper that is easy to absorb moisture on a horizontal table; [0004] 2. Take out the PCB board that has passed through the drying machine and tap it on the table, so that the undried water in the hole will drip onto the paved white paper under the action of external force and inertia. [0005] 3. Carefully observe the white...

AI Technical Summary

Problems solved by technology

[0006] The disadvantages of this method are: ①Using a large external force to act on the PCB board will cause damage or breakage of the substrate, and the strength of each person is inconsistent, and it may occur that the original bad drying is misjudged as normal drying due to insufficient strength ②It is not easy to observe, it needs more water to make the discoloration of white paper be noticed, when the slight water is not dried, it is easy to be ignored, causing serious consequences

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