Flexible chip pickup method and device

A pick-up equipment and flexible technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as fragmentation and fracture, and achieve the effect of improving yield, avoiding fragments, and improving picking quality.

Pending Publication Date: 2019-08-27
浙江荷清柔性电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, such traditional methods cannot be applied to the fragile and extremely thin flexible wafer packaging process. Due to the force exerted by the thimble and the adhesive force of the back film, flexible chips are prone to occur during the pick-up process due to uneven force. Fragments, fractures and other defects

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  • Flexible chip pickup method and device
  • Flexible chip pickup method and device
  • Flexible chip pickup method and device

Examples

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Embodiment Construction

[0037] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0038] Such as Figure 1-3 As shown, in this embodiment, the flexible chip picking method is used for the picking device to pick up the flexible chip 8 from the flexible wafer 1 (the flexible wafer with a thickness of 25 um or less is used in this embodiment). The pick-up equipment includes a pick-up platform (not shown) for placing the flexible wafer 1, a thimble 5 for lifting the flexible chip 8, a pick-up device 7 for picking up the flexible chip 8, and a thimble platform (not shown) on the top of the thimble 5. marked).

[0039] In this embodiment, the picked-up object is a large-size flexible chip 8 with a size greater than 5*5mm. The pickup methods include:

[00...

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Abstract

The invention discloses a flexible chip pickup method. Flexible chips are picked from ultrathin flexible wafers. The method comprises the steps of providing thermal stripping films; pasting the thermal stripping films to the backs of the ultrathin flexible wafers through adhesive layers; cutting and separating the flexible chips; heating the thermal stripping films to enable the adhesive layers tolose viscosity; jacking the flexible chips by using ejector pins, and separating the flexible chips from the thermal stripping films; and picking up the flexible chips. A flexible chip pickup deviceis used for picking up the flexible chips from the ultrathin flexible wafers, and comprises a pickup table for placing the ultrathin flexible wafers, the ejector pins used for jacking the flexible chips, and a chip pickup apparatus used for picking up the flexible chips; and the upper parts of the ejector pins are provided with platforms. According to the method disclosed by the invention, the problems that the flexible chips are easily broken due to uneven stress and cannot be stripped in the picking process are avoided, so that the yield of manufacturing the flexible chips is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a flexible chip picking method and picking equipment. Background technique [0002] As the next generation of electronic revolution, flexible electronics will be widely used in electronic communication, medical and military fields. In the past 10 years, flexible electronic technology has developed rapidly, and there are relatively mature solutions from flexible materials to flexible electronic packaging technology. At present, the traditional semiconductor packaging process is aimed at traditional wafers with a thickness of more than 100um, which are hard and not easy to break. Therefore, factors such as chip fragmentation and collapse will not be considered in the process of chip placement and wire bonding. [0003] The current process of the traditional automatic placement process is as follows: [0004] 1) Paste the thinned wafer back with a backing film and perform l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L21/687
CPCH01L21/67132H01L21/6836H01L21/68742H01L2221/68327H01L2221/6839
Inventor 滕乙超魏瑀刘东亮
Owner 浙江荷清柔性电子技术有限公司
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