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Flux and solder composition

A flux and composition technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problems of insufficient stability and stability, and achieve the effect of maintaining the wettability and viscosity of solder

Pending Publication Date: 2019-08-27
KOKI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even these fluxes are insufficient to ensure viscosity stability, especially viscosity stability during continuous use, while maintaining wettability.

Method used

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  • Flux and solder composition
  • Flux and solder composition
  • Flux and solder composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0063] Next, examples of the present invention will be described together with comparative examples. In addition, this invention is not limitedly interpreted as the following Example.

[0064] (Flux production)

[0065] The materials shown below were used in the recipes described in Table 1 to produce fluxes used in the respective examples and comparative examples (% in the table indicates mass %).

[0066] The production method is as follows. Each material was put into a heating container and heated to 180° C., and it was confirmed that all the materials were dissolved and dispersed. Thereafter, it was cooled to room temperature to obtain flux in a uniform state.

[0067] In addition, regarding rosin, a thixotropic agent, and an activating agent, each component was individually or mixed, and the acid value and viscosity of the flux were adjusted so that it may be in an appropriate range.

[0068]

[0069] · Rosin: super light color rosin (manufactured by Arakawa Chemica...

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Abstract

The present invention is a flux, etc., including a terpene phenol resin and having an acid value of 120 mg KOH / g or greater.

Description

technical field [0001] The present invention relates to a flux, and a solder composition containing the flux. Background technique [0002] A solder usable for joining electronic components and the like is formed of a solder composition containing a solder alloy and a flux. The flux is compounded into the solder composition to improve solderability, and contains various components such as a resin component, an activator component, a solvent component, an antioxidant component, and a thixotropic component. [0003] The above-mentioned components of the flux, such as the resin component and the activator component, act to remove the oxide film on the surface of the solder after coating the solder composition, the surface of the parts to be joined, the surface of the plated part of the substrate, etc., Thereby, solderability can be improved. On the other hand, these flux components may react with the solder alloy to increase the viscosity of the solder composition. In partic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26C22C13/00
CPCB23K35/26C22C13/00B23K35/262B23K35/362
Inventor 三角友理矢作武词佐佐木基秀马场达也轻部一磨
Owner KOKI
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