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A kind of high frequency and high speed copper clad laminate and preparation method thereof

A copper clad laminate, high-speed technology, applied in the field of high-frequency high-speed copper clad laminate and its preparation, can solve the problems of large loss, unstable transmission performance, etc., achieve high glass transition temperature, excellent dielectric properties, good heat resistance and The effect of flame retardancy

Active Publication Date: 2021-04-13
江门建滔电子发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin has many defects and cannot meet the needs of the current stage.
High-frequency and high-speed substrate materials mainly solve the high-frequency characteristic defects of unstable transmission performance and large loss of ordinary copper-clad laminates in the fields of microwave and millimeter waves in communication. It has become the mainstream technology in the development of the industry. , put forward a higher and more urgent demand

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A high-frequency high-speed copper-clad laminate and a preparation method thereof, the preparation method comprising the following steps:

[0022] Step S1, the preparation of resin glue: first, 80 parts by weight of bisphenol A type cyanate resin prepolymer and 30 parts by weight of furan resin are added to the reaction kettle for blending, and then, to the reaction kettle Add 10 parts of methyl ethyl ketone to dissolve it. After it is completely dissolved, stir the mixture evenly with a stirring bar, then heat the temperature of the reaction vessel to 85°C and keep it warm for 2 hours to obtain a furan resin / bisphenol A cyanate resin co- Mixture, continue to add 15 parts of unsaturated polyester resin to the reaction kettle, after stirring evenly, heat the temperature of the reaction kettle to 75 ° C, keep it warm for 2 hours, add 5 parts by weight of phthalic anhydride, 3 parts of accelerator, 5 parts of Add cobalt naphthenate, 5 parts of compatibilizer, 20 parts of f...

Embodiment 2

[0035] A high-frequency high-speed copper-clad laminate and a preparation method thereof, the preparation method comprising the following steps:

[0036] Step S1, the preparation of resin glue: first, 85 parts by weight of bisphenol A type cyanate resin prepolymer and 35 parts by weight of furan resin are added to the reaction kettle for mixing, and then, to the reaction kettle Add 15 parts of methyl ethyl ketone to dissolve it. After it is completely dissolved, stir the mixture evenly with a stirring bar, then heat the temperature of the reaction vessel to 88°C and keep it warm for 2.5 hours to prepare furan resin / bisphenol A cyanate resin Blend, continue to add 17 parts of unsaturated polyester resin to the reactor, stir evenly, heat the temperature of the reactor to 79°C, keep it warm for 2.5h, add 6 parts by weight of phthalic anhydride, 4 parts of accelerator, Add 7 parts of cobalt naphthenate, 5 parts of compatibilizer, 20 parts of filler and 11 parts of solvent into the...

Embodiment 3

[0049] A high-frequency high-speed copper-clad laminate and a preparation method thereof, the preparation method comprising the following steps:

[0050] Step S1, preparation of resin glue: first, 95 parts by weight of bisphenol A type cyanate resin prepolymer and 48 parts by weight of furan resin are added to the reaction kettle for blending, and then, to the reaction kettle Add 18 parts of methyl ethyl ketone to dissolve it. After it is completely dissolved, stir the mixture evenly with a stirring bar, then heat the temperature of the reaction kettle to 93°C and keep it warm for 3.5h to prepare furan resin / bisphenol A cyanate resin Blend, continue to add 26 parts of unsaturated polyester resin to the reactor, stir evenly, heat the temperature of the reactor to 83°C, keep it warm for 2.5h, add 7 parts by weight of phthalic anhydride, 5.5 parts of accelerator, Add 9 parts of cobalt naphthenate, 6.5 parts of compatibilizer, 35 parts of filler and 19 parts of solvent into the re...

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Abstract

The invention discloses a high-frequency high-speed copper clad laminate and a preparation method thereof. The preparation method comprises the following steps: step S1, preparation of resin glue; step S2, pretreatment of reinforcing materials; step S3, preparation of prepreg; step S4, manufacture of copper clad laminate. The present invention modifies bisphenol A cyanate resin through furan resin and unsaturated polyester resin, and the resin-reinforced glass fiber high-frequency and high-speed copper-clad laminate prepared by it has the electrical properties and insulation properties of traditional copper-clad laminates, etc. In addition to basic performance, it also overcomes some shortcomings of traditional copper-clad laminates, such as poor strength and flammability; the high-frequency and high-speed copper-clad laminates prepared by the present invention have excellent dielectric properties and high glass transition temperature, excellent heat resistance and flame retardancy, which can meet the needs of making high-frequency and high-speed circuit boards.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to a high-frequency high-speed copper clad laminate and a preparation method thereof. Background technique [0002] With the continuous development of the intelligent electronic information industry, nowadays, the penetration of computers, mobile communications and networks into every corner of life has made human society steadily move towards a highly informatized direction. Information processing and information communication constitute a highly informatized science. Two technical pillars in the development of the technical field. Information processing technology with high-level electronic computers as the main body pursues high-speed information processing, increased memory capacity, and miniaturized volume; on the other hand, in terms of information and communication technology, in order to ensure its continuous increase The communication capacity, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/08B32B27/20B32B33/00B32B37/06B32B37/10B32B38/16
CPCB32B15/08B32B15/20B32B27/08B32B27/20B32B33/00B32B37/06B32B37/10B32B38/164B32B2260/021B32B2260/046B32B2307/306B32B2307/3065B32B2307/558B32B2457/08
Inventor 周培峰
Owner 江门建滔电子发展有限公司
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