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Heat dissipating device

A technology of heat dissipation device and heat dissipation fin set, which is used in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. , to achieve the effect of improving the overall heat dissipation efficiency, promoting the circulation flow, and increasing the vaporization speed

Active Publication Date: 2019-09-03
泽鸿(广州)电子科技有限公司
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Problems solved by technology

[0004] However, in some usage scenarios, the existing heat dissipation devices using the principle of thermosiphon still have the situation that it is too late to dissipate heat from computers or various electronic devices due to the poor circulation of the internal working medium. After careful exploration by the applicant Later, it was found that the vaporization efficiency or liquefaction efficiency of the working medium in the cooling device is one of the important factors affecting the circulating flow of the working medium

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Embodiment Construction

[0033] The thermal contact referred to in this paper refers to the contact in the heat conduction, but in the actual structure, it includes at least two implementations of direct contact and indirect contact. Of course, it does not rule out that the two are very close but in Structurally untouched implementation. As far as the direct contact of two components is concerned, it refers to the direct bonding of the two components; as far as the indirect contact of the two components is concerned, a heat-conducting medium, such as heat-conducting paste, may be placed between the two components, but not in the above-mentioned limit.

[0034] see Figure 1 ~ Figure 3 , figure 1 It is a schematic diagram of the appearance structure of a heat sink of the present invention in a first preferred embodiment, figure 2 for figure 1 A three-dimensional exploded schematic diagram of a partial structure of the heat dissipation device shown, image 3 for figure 1 A schematic cross-section...

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Abstract

The invention provides a heat dissipating device comprising a cavity, a plurality of tubes, a cooling fin group disposed on the peripheries of the plurality of tubes, and a gasifying structure. The cavity has a chamber and is in thermal contact with a heat source. Each tube has a passage therein. The first end of the passage is in fluid communication with a first chamber. The chamber of the cavityand the passages of the plurality of tubes are filled with a working medium. The gasifying structure is disposed in the chamber of the cavity, and is in thermal contact with the cavity and at least apart of the working medium to receive the heat energy from the heat source and transfer the heat energy to the working medium in order that the working medium is subjected to liquid-gas conversion and moves the second end of the first passage. The gasifying structure can increase the thermal contact area and enhance the gasifying efficiency of the working medium so as to promote the circular flowof the working medium of the heat dissipating device and improve the overall heat dissipating efficiency.

Description

technical field [0001] The present invention relates to a heat dissipation device, in particular to a heat dissipation device that dissipates heat through two-phase change. Background technique [0002] With the rapid development of computers and various electronic devices, modern people have developed the habit of using them for a long time because of the convenience they bring. However, during the long-term operation of computers and various electronic devices, The shortcoming that the heat can not be dissipated in time is also accompanied by it. [0003] In view of this, many heat-dissipating implementation methods such as heat dissipation by means of airflow (fan), water cooling, and heat dissipation through the principle of thermosiphon are widely used. The circulating flow of the working medium can be maintained on the premise of a pump for the working medium (such as water). At present, many related researches and technologies have been proposed, as disclosed in US P...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20327
Inventor 陈建安范牧树陈建佑
Owner 泽鸿(广州)电子科技有限公司
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