Silver paste based flexible stretchable circuit carrier

Abstract

The invention discloses a silver paste based flexible stretchable circuit carrier. The silver paste based flexible stretchable circuit carrier comprises a flexible stretchable carrier and silver paste, wherein the silver paste is smeared onto the flexible stretchable carrier according to requirements; the silver paste comprises silver particles, silicone oil, methyl trichlorosilane, trimethylchlorosilane and phenylchloride, the silver particles are nanoscale silver particles, and the particle diameters of the nanoscale silver particles are 3 to 30 nm; the weight of the silver particles is 50 to 90 parts by weight, and the weight of the silicone oil is 5 to 30 parts by weight, wherein the molecular weight of the silicone oil reaches more than 0.5 million. The invention provides the silver paste based flexible stretchable circuit carrier which is high in adsorption capacity, high in rebound resilience, resistant to high temperature and high in thermal conductivity.

Description

technical field [0001] The invention relates to the field of silver paste, more specifically, it relates to a flexible and stretchable circuit carrier based on silver paste. Background technique [0002] In the prior art, the function of transparent conduction can be partially realized by using common non-specialized silver paste for metal grids. However, the existing silver paste has some interactions with polymer substrates such as PET (polyethylene terephthalate). Problems such as low adhesion, easy to fall off, broken grid lines, and cracked side walls of metal silver grid lines have greatly affected product yield, especially on PET substrates larger than 50 inches, broken lines, cracked side walls, etc. The problem seriously reduces the yield rate of the product. At the same time, the heating temperature is above 150°C. Due to the influence of heating and stretching, it is difficult for the PET substrate to withstand the temperature of 150°C. Contents of the inventio...

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Problems solved by technology

[0002] In the prior art, the function of transparent conduction can be partially realized by using common non-specialized silver paste for metal grids. However, the existing silver paste has some interactions with polymer substrates such as PET (polyethylene terephthalate). Problems such as low adhesion, easy to fall off, broken grid lines, and cracked side walls of metal silver grid lines have greatly affected product yield, especially on PET substrates larger than 50 inches, broken lines, cracked side walls, etc. The problem seriously reduces the yield of the product

At the same time, the heating temperature is above 150°C. Due to the influence of heating and stretching, it is difficult for the PET substrate to withstand the temperature of 150°C.

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