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Method for improving glue shortage in open areas of multilayer boards

A multi-layer board and hollow technology, which is applied in multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve problems such as lack of glue and voids, insufficient glue filling, and whitening of the base material area of ​​multi-layer boards, and achieve reduction Pressing capacity, increasing production process, and production efficiency have no effect

Inactive Publication Date: 2019-09-06
SHENZHEN CHANGDONGXIN PCB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous evolution of PCB design, the customer considers the influence of the interference layer when designing the board. In many board designs, in order not to affect signal transmission, a large area of ​​copper-free area appears during the inner layer design. Insufficient glue filling and whitening and voids in the substrate area of ​​multi-layer boards often occur. Multi-layer boards are high-value products of the factory, and there are quality problems such as lack of glue and voids, which seriously affect the cost of the company and the quality of the client. , so research and analysis on this issue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The invention provides a method for improving the lack of glue in the open area of ​​a multilayer board, which includes the following steps:

[0021] Step 1. Inner layer circuit: According to the copper foil of each layer that meets the design requirements, the inner layer circuit is exposed on the board, and then the required pattern is etched by etching to form a conductive circuit;

[0022] Step 2. Targeting: use the X-RAY drilling machine to grab the inner target, drill the positioning hole on the edge of the gong, and measure the distance of the target hole at the same time, and compare it with the standard distance of the MI data to obtain the expansion and contraction value of the production board, and distinguish Boards with different expansion and contraction, after being divided into piles, the edge of the next process is produced according to different drill belt coefficients;

[0023] Step 3, Browning: After inner layer cutting, inner layer D / F, and inner la...

Embodiment 2

[0028] The invention provides a method for improving the lack of glue in the open area of ​​a multilayer board, which includes the following steps:

[0029] Step 1. Inner layer circuit: According to the copper foil of each layer that meets the design requirements, the inner layer circuit is exposed on the board, and then the required pattern is etched by etching to form a conductive circuit;

[0030] Step 2. Targeting: use the X-RAY drilling machine to grab the inner target, drill the positioning hole on the edge of the gong, and measure the distance of the target hole at the same time, and compare it with the standard distance of the MI data to obtain the expansion and contraction value of the production board, and distinguish Boards with different expansion and contraction, after being divided into piles, the edge of the next process is produced according to different drill belt coefficients;

[0031] Step 3, Browning: After inner layer cutting, inner layer D / F, and inner la...

Embodiment 3

[0036] The invention provides a method for improving the lack of glue in the open area of ​​a multilayer board, which includes the following steps:

[0037] Step 1. Inner layer circuit: According to the copper foil of each layer that meets the design requirements, the inner layer circuit is exposed on the board, and then the required pattern is etched by etching to form a conductive circuit;

[0038] Step 2. Targeting: use the X-RAY drilling machine to grab the inner target, drill the positioning hole on the edge of the gong, and measure the distance of the target hole at the same time, and compare it with the standard distance of the MI data to obtain the expansion and contraction value of the production board, and distinguish Boards with different expansion and contraction, after being divided into piles, the edge of the next process is produced according to different drill belt coefficients;

[0039] Step 3, Browning: After inner layer cutting, inner layer D / F, and inner la...

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PUM

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Abstract

The invention discloses a method for improving glue shortage in open areas of multilayer boards. The method comprises the steps of inner layer line exposing, targeting, browning, riveting, typesettingand pressing. A coating material is used for typesetting; multilayer base materials are overlapped in the open areas and pressed once; silica gel and a PE film are adopted for coating; the PE film ismade of the coating material; due to the use of the coating material, slight fluidity exists, so that the copper wrinkle phenomenon on the surface after pressing is avoided, and the white spot phenomenon in the open areas of the base materials after etching is avoided; and moreover, the overlapping design is not changed, the pressing production capacity is not reduced, the production efficiency is not influenced, a special material is used for production, and the production process is not added.

Description

technical field [0001] The invention relates to a method for improving glue shortage, in particular to a method for improving glue shortage in open areas of multilayer boards. Background technique [0002] With the continuous evolution of PCB design, the customer considers the influence of the interference layer when designing the board. In many board designs, in order not to affect signal transmission, a large area of ​​copper-free area appears during the inner layer design. Insufficient glue filling and whitening and voids in the substrate area of ​​multi-layer boards often occur. Multi-layer boards are high-value products of the factory, and there are quality problems such as lack of glue and voids, which seriously affect the cost of the company and the quality of the client. , so research and analysis on this issue is done. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention provides a method for improving t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 班万平刘宝涛
Owner SHENZHEN CHANGDONGXIN PCB CO LTD
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