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A kind of lead frame and its manufacturing method

A manufacturing method and lead frame technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as prone to failure, large internal stress of each monomer, and great influence

Active Publication Date: 2021-05-07
NINGBO GANGBO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of processing the rectifier bridge, high-temperature packaging steps are required. For metals such as copper, thermal expansion and contraction vary greatly. The entire frame is stamped from a piece of copper, and the overall deformation has a great impact on each monomer. After cooling, the internal stress of each monomer is very large, which also causes poor consistency of the product and is prone to failure
[0004] Moreover, for customers, after completing the packaging of the rectifier bridge, they need to cut off the frame and connecting strips before using it, which is also very troublesome, and after cutting, the obtained rectifier bridge units are scattered, and special The equipment can only be packaged and shipped after finishing, so it is necessary to improve

Method used

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  • A kind of lead frame and its manufacturing method
  • A kind of lead frame and its manufacturing method
  • A kind of lead frame and its manufacturing method

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Embodiment Construction

[0022] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0023] see Figure 1-2 , a lead frame, comprising a frame 1 made of plastic and a connecting bar 2, the connecting bar 2 is connected to two opposite sides of the frame 1, there are many connecting bars 2, and a plurality of connecting bars 2 are connected to each other Parallel setting.

[0024] One end of the pin 3 made of copper is arranged inside the connecting bar 2 , the other end of the pin 3 protrudes from the connecting bar 2 , and the front end of the pin 3 is provided with a contact piece 31 . A bend 32 is provided at the connection between the pin 3 and the contact piece 31 . In the present invention, each pin is independent, so after the lead wire is made into a rectifier bridge, no internal stress will be generated, and after the lead wire is made into a finished product, the frame and connecting strip do not need to be cut, and ...

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PUM

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Abstract

The invention discloses a lead frame, which comprises a frame made of plastic and a connecting bar, the connecting bar connects two opposite sides of the frame, and a pin made of copper is arranged in the connecting bar, and the pin is One end of the pin protrudes from the connecting strip, and the front end of the pin is provided with a contact piece. In the present invention, each pin is independent, so after the lead wire is made into a rectifier bridge, no internal stress will be generated, and after the lead wire is made into a finished product, the frame and connecting strip do not need to be cut, and can be directly used as a part of the finished product package , when we need to use it, we only need to pull the pin out from the connection strip.

Description

technical field [0001] The present invention relates to an electronic device, more specifically, to a lead frame and a manufacturing method thereof. Background technique [0002] Rectifier bridges are now mass-produced, and copper frames are used in mass production. This frame is made of a piece of copper by stamping out excess parts. [0003] In the process of processing the rectifier bridge, high-temperature packaging steps are required. For metals such as copper, thermal expansion and contraction vary greatly. The entire frame is stamped from a piece of copper, and the overall deformation has a great impact on each monomer. After cooling, the internal stress of each monomer is very large, which also causes poor consistency of the product and is prone to failure. [0004] Moreover, for customers, after completing the packaging of the rectifier bridge, they need to cut off the frame and connecting strips before using it, which is also very troublesome, and after cutting, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/48
CPCH01L21/4839H01L21/4842H01L23/49517H01L23/4952H01L2224/97
Inventor 徐红波
Owner NINGBO GANGBO ELECTRONICS CO LTD