A kind of lead frame and its manufacturing method
A manufacturing method and lead frame technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as prone to failure, large internal stress of each monomer, and great influence
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[0022] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
[0023] see Figure 1-2 , a lead frame, comprising a frame 1 made of plastic and a connecting bar 2, the connecting bar 2 is connected to two opposite sides of the frame 1, there are many connecting bars 2, and a plurality of connecting bars 2 are connected to each other Parallel setting.
[0024] One end of the pin 3 made of copper is arranged inside the connecting bar 2 , the other end of the pin 3 protrudes from the connecting bar 2 , and the front end of the pin 3 is provided with a contact piece 31 . A bend 32 is provided at the connection between the pin 3 and the contact piece 31 . In the present invention, each pin is independent, so after the lead wire is made into a rectifier bridge, no internal stress will be generated, and after the lead wire is made into a finished product, the frame and connecting strip do not need to be cut, and ...
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