Thin-film encapsulation structure, manufacturing method of thin-film encapsulation structure, and display device
A thin-film packaging and manufacturing method technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of poor protection performance and poor barrier properties of packaging structures, and achieve the effect of improving protection ability and strong barrier ability.
Active Publication Date: 2022-02-08
YUNGU GUAN TECH CO LTD
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Problems solved by technology
Common packaging structures include thin-film encapsulation (Thin-Film Encapsulation, TFE) structure, which covers the OLED device with an organic film layer for protection. However, the organic film layer has poor barrier properties to water vapor, oxygen, etc., making the existing packaging structure Poor protection
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[0032] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.
[0033] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...
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Abstract
The invention discloses a film encapsulation structure, a manufacturing method of the film encapsulation structure and a display device. The film encapsulation structure comprises: a first inorganic layer group; an organic layer located on the first inorganic layer group; and a second inorganic layer group located on the On the organic layer, the first inorganic layer group and the second inorganic layer group respectively include more than two sub-inorganic layers stacked, wherein at least one pair of at least any one of the first inorganic layer group and the second inorganic layer group is adjacent A toughness layer is interposed between the sub-inorganic layers, and the toughness of the toughness layer is greater than that of each sub-inorganic layer. According to the thin film encapsulation structure of the embodiment of the present invention, while obtaining higher water and oxygen barrier capability, its bendability is improved.
Description
technical field [0001] The invention relates to the field of display packaging, in particular to a thin film packaging structure, a manufacturing method of the thin film packaging structure, and a display device. Background technique [0002] Organic Light Emitting Display (OLED) display devices, as flat display devices, are widely used in mobile phones, televisions, and personal digital assistants due to their advantages of high image quality, power saving, thin body, and wide application range. , digital cameras, notebook computers, desktop computers and other consumer electronics products have become the mainstream of display devices. [0003] OLED devices are more sensitive to external water vapor, oxygen and other factors. Once water vapor, oxygen, etc. enter the OLED device, its stability and life will be affected, so it needs to be protected by a packaging structure. Common packaging structures include thin-film encapsulation (Thin-Film Encapsulation, TFE) structure,...
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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8445H10K71/00
Inventor 黄振
Owner YUNGU GUAN TECH CO LTD