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Power module

A power module and power chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems affecting the precise running performance of motors, and achieve the effects of easy installation, small module area, and reduced parasitic inductance

Pending Publication Date: 2019-09-13
SHENZHEN YITONG POWER ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the working process of the motor, since the motor is an inductive load, the parasitic inductance of the existing power module produces waveform oscillation during the switching process of the power module, which affects the precise operation performance of the motor

Method used

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Embodiment Construction

[0035] The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

[0036] See figure 1 , 2 The first preferred embodiment of a power module 100 according to the present invention includes an insulating substrate 1, a first bridge arm conductive layer 2 disposed on the insulating substrate 1, and multiple bridge arm conductive layers disposed on the first bridge arm conductive layer 2. A first bridge arm power chip 3 ( figure 1 and figure 2 Only five power chips of the first bridge arm are shown in the figure), the second bridge arm conductive layer 4 arranged on the insulating substrate 1, a plurality of second bridge arm power chips 5 arranged on the second bridge arm conductive layer 4 ( figure 1 and figure 2 Only five second bridge arm po...

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Abstract

The present invention provides a power module. The power module comprises: an insulation substrate, a first bridge arm conductive layer arranged on the insulation substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, a second bridge arm conductive layer arranged on the insulation substrate, a plurality of second bridge arm power chips arranged onthe second bridge arm conductive layer, a first bridge arm electrode conductive layer arranged on the insulation substrate, a first electrode conductive bar arranged on the first bridge arm electrodeconductive layer, a second electrode conductive bar arranged on the second bridge arm conductive layer, an output electrode conductive layer arranged on the insulation substrate, and an output electrode conductive bar arranged on the output electrode conductive layer. The first bridge arm power chips are electrically connected with the first bridge arm electrode conductive layer, the first bridgearm conductive layer is electrically connected with the output electrode conductive layer, and the second bridge arm power chips are electrically connected with the output electrode conductive layer.

Description

technical field [0001] The invention relates to the technical field of electronic power, in particular to a power module. Background technique [0002] The power module is a power switch module packaged by power electronic power devices such as metal oxide semiconductor (power MOS tube), insulated gate field effect transistor (IGBT), and fast recovery diode (FRD) according to certain functions. It is mainly used for Power conversion in various occasions such as electric vehicles, wind power generation, and industrial frequency conversion. [0003] The motor drive circuit of an electric vehicle usually includes three groups of power modules, which provide three-phase AC power for the motor. During the working process of the motor, since the motor is an inductive load, the parasitic inductance of the existing power module generates waveform oscillation during the switching process of the power module, which affects the precise operation performance of the motor. Contents of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/488H01L23/60H01L23/31H01L25/07
CPCH01L23/49805H01L23/49811H01L23/49838H01L23/488H01L23/3121H01L25/072H01L2224/49113H01L2224/0603H01L2224/49111H01L2224/49175H01L2924/19107H01L2224/4811
Inventor 徐文辉
Owner SHENZHEN YITONG POWER ELECTRONICS CO LTD
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