Stress detection instrument for a novel transparent material

Abstract

The invention provides a stress detection instrument for a novel transparent material, and the instrument is characterized by comprising a light source, two groups of polaroids, a rotating device and a power supply, wherein the light source is electrically connected with a power supply, one or two groups of polaroids are arranged on the rotating device, and can rotate along with the rotation of the rotating device. The stress detection instrument of the novel transparent material can observe the spectral characteristics of a product to be detected from an upper polaroid group to judge the specific stress state of the product to be detected, namely the specific distribution condition of the material in the product, the specific flow state of the material in the product in the forming process or the specific defect of the material in the product in the forming process, and according to the specific stress state of the product, namely, the specific distribution condition of the materials in the product, the specific flow state of the materials in the product in the forming process or the specific defects of the materials in the product in the forming process provide basis and parameters for the perfection of the forming process of a composite material.

Description

technical field [0001] The invention relates to a stress detection instrument, in particular to a novel stress detection instrument for transparent materials. Background technique [0002] When an object is deformed due to external factors, such as force, humidity, temperature field changes, etc., an internal force that interacts with each part of the object is generated, and the internal force per unit area is called stress. The stress is a vector, and the component in the opposite direction along the section is called normal stress, and the component along the tangential direction is called shear stress. [0003] Due to the existence of stress, after being subjected to external effects, such as contacting chemical solvents during pad printing or baking at a high temperature when the back end of the paint is baked, the stress will be induced to release and crack at the position where the stress remains. Cracking is mainly concentrated at the gate or overfill. [0004] Due...

AI Technical Summary

Problems solved by technology

However, no interferometer is used to detect the change of the optical path of the reflected light caused by the change of the surface microstructure, and to obtain the information of the change of the surface structure caused by the internal stress and the change of the surface structure itself

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