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Multi-head laser machining equipment for OLED display panel

A technology for laser processing and display panels, applied in the field of OLED display panels, can solve the problems of limited processing efficiency, long processing time, and low efficiency of OLED mother sheets, and achieve the effects of shortening processing time, improving production yield, and improving packaging precision

Inactive Publication Date: 2019-09-20
AENEQ CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing technology generally uses a laser lens for laser packaging, which takes a long time per unit of processing and low efficiency; especially when packaging or cutting small-sized OLEDs, such as OLED panels for smart watches, the current mainstream production line has entered the sixth generation (glass The size of the substrate is 1500mm x 1850mm), even if a quarter of it is 750mmx925mm, if it is a small-sized panel, such as Apple's smart watch, even a quarter of the glass substrate has a lot of single-chip OLED panels , then the processing efficiency of single-head laser packaging equipment for OLED mother sheets is relatively limited.

Method used

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  • Multi-head laser machining equipment for OLED display panel
  • Multi-head laser machining equipment for OLED display panel
  • Multi-head laser machining equipment for OLED display panel

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Embodiment Construction

[0050] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with illustrations and specific embodiments.

[0051] combine Figure 1 to Figure 4 As shown, a multi-head laser processing equipment for OLED display panels proposed by the present invention includes a work platform 10 and a support 20 arranged on the upper end of the work platform 10, and a main X-axis linear module is arranged on the support 20 30, the main X-axis linear module 30 is provided with a multi-head laser mechanism 40; the upper end of the working platform 10 is also provided with a mobile carrier plate 50, and the mobile carrier plate 50 is used to limit the OLED mother sheet 60 fixed, the moving carrier plate 50 passes under the multi-head laser mechanism 40 through the Y-axis linear module 70 .

[0052] Wherein, the moving tray 50 includes a tray main body ...

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Abstract

The invention relates to the technical field of OLED display panels. A multi-head laser machining equipment for an OLED display panel comprises a working platform and a support arranged at the upper end of the working platform. The equipment is characterized in that a main X-axis linear module is arranged on the support, and a multi-head laser mechanism is arranged at the position where the main X-axis linear module is located; and the upper end of the working platform is also provided with a movable carrier disc, the movable carrier disc is used for limiting and fixing an OLED master slice, and the movable carrier disc penetrates through the lower part of the multi-head laser mechanism through a Y-axis linear module.

Description

technical field [0001] The invention relates to the technical field of OLED display panels, in particular to a multi-head laser processing equipment for OLED display panels. Background technique [0002] Modern electronic technology is developing rapidly, especially the display technology, from the mature LCD to the more and more widely used OLED, and now it has developed into a flexible and bendable OLED display panel. The production of OLED display panels is more difficult, and the process is quite different from that of LCD display panels. The yield rate is much lower than that of LCD panels, especially the flexible OLED display panels that have just been introduced to the market. The yield rate is even lower. [0003] In the production of OLED panels, after the plating of each functional layer, packaging and cutting processes are required; especially the packaging process requires very high precision control, and most of the current market uses laser packaging technology...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/06B23K26/20B23K26/38B23K26/70
CPCB23K26/00B23K26/06B23K26/20B23K26/38B23K26/702
Inventor 赖耀升金渶桓江建志王为新
Owner AENEQ CO LTD
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