High-temperature cracking furnace for vacuum coating

Abstract

The invention discloses a high-temperature cracking furnace for vacuum coating. The high-temperature cracking furnace comprises a low-temperature evaporation area, a control valve, a high-temperature cracking area and a heating and temperature measuring assembly. A dual-layer warm area furnace is adopted by the low-temperature evaporation area, cooling water is input between two furnace layers, a crucible is arranged in the low-temperature evaporation area, and a cracker is arranged in the high-temperature area. The temperature of the crucible and the temperature of the cracker are controlled by heating lamp filaments through a power controller. A solid source is loaded in the crucible. Under the vacuum environment, the low-temperature evaporation area carries out heating under the temperature ranging from 300 DEG C to 400 DEG C, organic matter can be directly sublimated into steam without a liquid state, the steam is directly guided to the high-temperature cracking area through the control valve, cracking is carried out at the temperature ranging from 850 DEG C to 1000 DEG C, and finally the steam is sprayed out through the nozzle. The pressure of main evaporation steam is high, but clustered matter (such as As, Se and Sb) is prone to being formed, the high-temperature cracking furnace is suitable for any high-precision film growth equipment, the film growth rate is low, and one monatomic layer can grow every second.

Description

technical field [0001] The invention relates to a high-temperature cracking device, which is suitable for evaporating substances with high vapor pressure but easy to form clusters, in particular to a high-temperature cracking furnace for vacuum coating. Background technique [0002] The cracking furnace is a kind of evaporation source, which is mainly used in the growth of molecular beam epitaxy thin films. The existing domestic evaporation sources are heated once, which can meet the requirements for most substances, but when evaporating solid substances with high vapor pressure but easy to form clusters (such as As, Se, Sb, etc.), these The solid is decomposed into molecules (or atoms) uniformly, and it cannot meet the requirements of coating. [0003] Since the evaporation coating process is carried out at high temperature, and when the existing evaporation source evaporates these special substances, its particle movement speed cannot be better controlled, resulting in a ...

AI Technical Summary

Problems solved by technology

The existing domestic evaporation sources are heated once, which can meet the requirements for most substances, but when evaporating solid substances with high vapor pressure but easy to form clusters (such as As, Se, Sb, etc.), these Solids are evenly decomposed into molecules (or atoms), and cannot meet the requirements of coating

[0003] Since the evaporation coating process is carried out at high temperature, and when the existing evaporation source evaporates these special substances, its particle movement speed cannot be better controlled, resulting in a fast growth of the film, the accuracy cannot be guaranteed, and there are The problem that a large amount of raw materials cannot be better utilized

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