Cleaning machine

Abstract

The invention provides a cleaning machine. The cleaning machine comprises a body provided with a chamber. A number of accommodation chambers spaced along the length direction of the chamber are defined in the chamber. The body is provided with an inlet and an outlet, which are communicated with the chamber. The cleaning machine further comprises a number of cleaning tanks which are arranged in thecorresponding accommodation chambers. Air inlets are arranged at positions corresponding to the slots of the cleaning tanks in the body respectively. Air outlets are arranged at positions corresponding to the bottoms of the cleaning tanks in the body respectively. An air supply device is arranged in the accommodation chamber where at least one cleaning tank is located. The air outlet of the air supply device faces the air inlet opposite thereto. According to the cleaning machine provided by the invention, the cleaning machine can easily control gas flow, so as to control the atmosphere of theareas where different cleaning tanks are located; gas volatilized by cleaning liquid in a cleaning tank is prevented from affecting other areas; and the cleaning quality of a silicon wafer is improved.

Description

technical field [0001] The invention relates to the field of semiconductor cleaning, in particular to a cleaning machine. Background technique [0002] With the increasing refinement of semiconductor components, in terms of yield and reliability, the importance of removing particles and tiny corrosion pits on the surface of silicon wafers has become increasingly prominent. The substances or forms on the surface of these silicon wafers directly lead to the performance of subsequent components. and reliability. In the current silicon wafer manufacturing process, about half of the work is to clean the silicon wafers, and various types of cleaning machines are used to clean the silicon wafers. [0003] At present, SC-1 and SC-2 are used for cleaning in the general semiconductor industry. SC-1 is a mixed solution of ammonia and hydrogen peroxide, and SC-2 is a mixed solution of hydrochloric acid and hydrogen peroxide. Some of these reagents are more volatile ammonia water and h...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a washing machine to solve the problem that when the washing machine cleans silicon wafers, the chemical gas volatilized by the cleaning liquid is difficult to control, and the volatilized ammonia and hydrochloric acid are easy to enter other areas, affecting the atmosphere in other areas, and affecting other areas. The cleaning of silicon wafers will affect the cleaning quality of silicon wafers.

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