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Ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing method and device

A magnetic field-assisted and abrasive flow technology, applied in the field of ultra-precision machining, can solve problems such as low surface quality, low processing efficiency, and uneven surface roughness of workpieces, and achieve consistent surface roughness, improve processing efficiency, and improve polishing force distribution uniform effect

Active Publication Date: 2019-10-11
ZHEJIANG UNIV OF TECH
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Problems solved by technology

[0004] In order to overcome the problems of uneven surface roughness, low surface quality and low processing efficiency of polished workpieces in low-pressure abrasive flow polishing, the invention provides a method for uniform surface roughness, improved surface quality, and improved processing efficiency of workpieces after polishing. Ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing method and device

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  • Ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing method and device

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] refer to Figure 1 to Figure 7 , an ultrasonic cavitation and magnetic field-assisted low-pressure abrasive flow polishing method, wherein the abrasive flow polishing is carried out in a low-pressure fluid; the abrasive flow polishing is carried out in a wedge-shaped flow channel; the inclination angle of the upper top surface of the wedge-shaped flow channel can be Adjustment is achieved by replacing the angle block parts placed in the processing device; the cavitation is ultrasonic cavitation, and cavitation bubbles are generated in the abrasive flow by an ultrasonic generator installed in front of the flow channel inlet of the processing device; the magnetic field An adjustable and uniform magnetic field perpendicular to the surface of the workpiece generated by an electromagnet placed directly below the processing device. Under the action of the magnetic fie...

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Abstract

The invention discloses an ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing method. The abrasive flow polishing is conducted in low-pressure fluid; the abrasive flow polishing is conducted in a wedge-shaped flow channel; the inclined angle of the upper top surface of the wedge-shaped flow channel is adjustable, and the adjustment of the angle is realized by replacing an angular gauge block part arranged in a machining device; the cavitation is ultrasonic cavitation, and cavitation bubbles are generated in the abrasive flow through an ultrasonic generator installed in front of a flow channel inlet of the machining device; a magnetic field is an intensity-adjustable uniform magnetic field which is generated by an electromagnet arranged under the machining device and is perpendicular to the surface of a workpiece, under the action of the magnetic field, magnetic abrasives in a flow field are magnetized and move towards the surface of the workpiece under the action of the magnetic field force. The invention further provides an ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing device. The ultrasonic cavitation and magnetic field assisted low-pressure abrasive flow polishing method and device have the advantages that the surface roughness is uniform, the surface quality is improved and the machining efficiencyis improved after the workpiece is polished.

Description

technical field [0001] The invention belongs to the field of ultra-precision machining, and relates to an ultrasonic cavitation and magnetic field-assisted low-pressure abrasive flow polishing method and device. Background technique [0002] Low-pressure abrasive flow polishing is a new type of processing technology, using fluid as the carrier of abrasive particles, and polishing the surface of the workpiece through the flow of abrasive particles relative to the surface of the workpiece. The traditional polishing process, such as grinding, is to polish the workpiece surface with free abrasive grains on the grinding disc. Since the distribution of free abrasive grains on the grinding disc is very uneven, it is easy to cause the surface of the workpiece after grinding. The surface roughness of each part is not equal, and it is easy to cause surface damage, which seriously affects the performance of the workpiece. In the current relatively advanced magnetic grinding process, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04
CPCB24B1/005B24B1/04
Inventor 赵军彭浩然方海东
Owner ZHEJIANG UNIV OF TECH
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