A dust-removing type chip sorting device with voltage stabilizing function

Abstract

The invention relates to a dust-removing type chip sorting device with a voltage stabilizing function, which includes a vacuum pump, a suction pipe and a suction nozzle, and also includes a pressure regulating mechanism and a dust removing mechanism. The pressure regulating mechanism includes a cover plate, a drive assembly, a voltage stabilizing tube, Two first transmission rods, two support sleeves, two springs and two connecting blocks, the dust removal mechanism includes a baffle, a collection box, a filter screen, a second air delivery pipe, a first air delivery pipe and a solenoid valve. In the dust-removing type chip sorting equipment with voltage stabilization function, the suction inside the straw can be controlled through the pressure regulating mechanism, which reduces the probability of chip damage due to excessive suction and improves the practicability of the sorting equipment. Compared with the pressure mechanism, the pressure regulation mechanism can adjust the maximum suction force inside the straw by adjusting the length of the spring, which further improves the practicability of the sorting equipment. Not only that, the dust on the chip can be sucked away by the dust removal mechanism, This improves the quality of the chips produced.

Description

technical field [0001] The invention relates to the field of chip sorting equipment, in particular to a dust-removing type chip sorting device with a voltage stabilizing function. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , Although the holding tape bonded to the back is cut into a little, it is not cut, and it becomes the state of holding each semiconductor chip. Next, each cut semiconductor chip is picked up from the holding tape by a chip sorter. During the picking process, the chip is first Lift up from the wafer, and then absorb the surface of the chip through the suction nozzle to achieve peeling and transfer. [0003] When the chip sorting equipment in the prior art is in use, if the air pressur...

AI Technical Summary

Problems solved by technology

[0003] When the chip sorting equipment in the prior art is in use, if the air pressure for sucking the chips is too high, the chips will be damaged. Therefore, it is necessary to adjust the air pressure accurately. Not only that, the chips may be adsorbed on the chips during sorting. There is dust, if the dust is not removed in time, it will affect the quality of the chip

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