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High CTI epoxy resin for copper-clad plates and preparation method thereof

A technology of epoxy resin and liquid epoxy resin, which is applied in the field of high CTI epoxy resin for copper clad laminates and its preparation, can solve the problems of epoxy resin mechanical properties, poor thermal stability, and reduced flame retardancy, and achieve resin synthesis The effect of high conversion rate, excellent flame retardancy, and high thermal stability

Active Publication Date: 2019-10-18
建滔(广州)电子材料制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve the problem in the prior art that although the CTI index is increased, the flame retardancy is greatly reduced, and also in order to solve the problems of poor mechanical properties and thermal stability of the epoxy resin in the prior art, the present invention provides a copper clad laminate. High CTI epoxy resin

Method used

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  • High CTI epoxy resin for copper-clad plates and preparation method thereof
  • High CTI epoxy resin for copper-clad plates and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] (1) Preparation of resin:

[0052] Put 320 parts of bisphenol A liquid epoxy resin into the reaction kettle, heat to 80°C under nitrogen protection, start stirring, stir for 15 minutes at a stirring speed of 500r / min, and put 200 parts of tetrabromobisphenol A , 12 parts of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, bisphenol A liquid epoxy resin, tetrabromobisphenol A, tetrafunctional phenolic resin with a mass ratio of 1.65:1:0.06 Proportionally added to the reaction kettle, after the feeding was completed, the temperature was raised to 115°C within 40 minutes, and 0.1 part of ethyl triphenylphosphine bromide was added, heated and controlled at 165°C, and reacted for 3 hours to obtain an intermediate resin; Add 110 parts of bisphenol A liquid epoxy resin, control the temperature at 148°C, stir and react at a stirring speed of 600r / min for 15 minutes to obtain a brominated epoxy resin; stop nitrogen, add 190 parts of acetone to dissolve the brominated ring Oxygen resin,...

Embodiment 2

[0056] (1) Preparation of resin:

[0057] Put 310 parts of bisphenol A liquid epoxy resin into the reaction kettle, heat to 90°C under nitrogen protection, start stirring, stir for 30 minutes at a stirring speed of 50r / min, and put 200 parts of tetrabromobisphenol A , 10 parts of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, bisphenol A liquid epoxy resin, tetrabromobisphenol A, tetrafunctional phenolic resin with a mass ratio of 1.55:1:0.05 Proportionally added to the reaction kettle, after the addition, the temperature was raised to 110°C within 30 minutes, and 0.4 parts of a mixture of tetrabutylammonium bromide and tetramethylammonium chloride were added, heated and controlled at 175°C, and reacted for 0.5h to obtain intermediate body resin; add 130 parts of bisphenol A liquid epoxy resin to the reaction kettle again, control the temperature at 145 ° C, stir and react for 30 min under the condition of stirring speed of 50 r / min, and obtain brominated epoxy resin; stop nitrogen,...

Embodiment 3

[0061] (1) Preparation of resin:

[0062] Put 330 parts of bisphenol A liquid epoxy resin into the reaction kettle, heat to 85°C under nitrogen protection, start stirring, stir for 5 minutes at a stirring speed of 1000r / min, and put 220 parts of tetrabromobisphenol A , 15 parts of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, bisphenol A liquid epoxy resin, tetrabromobisphenol A, tetrafunctional phenolic resin with a mass ratio of 1.5:1:0.07 Proportionally added to the reaction kettle, after the feeding, the temperature was raised to 120°C within 60 minutes, 0.022 parts of triphenylphosphine was added, heated and the temperature was controlled at 170°C, and the reaction was carried out for 2 hours to obtain an intermediate resin; 120 parts of bis Phenol A type liquid epoxy resin, control the temperature at 150°C, stir and react at a stirring speed of 650r / min for 8 minutes to obtain brominated epoxy resin; stop nitrogen, add 195 parts of toluene to dissolve the brominated epoxy res...

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Abstract

The invention relates to the field of epoxy resin, in particular to a high CTI epoxy resin for copper-clad plates and a preparation method thereof. The high CTI epoxy resin is prepared from the following raw materials: bisphenol A liquid epoxy resin, tetrabromobisphenol A, tetrafunctional phenolic resin, phosphorus-containing epoxy resin, bisphenol A phenolic epoxy resin, an epoxy toughening agent, a catalyst and a solvent. The epoxy resin obtained by the invention has excellent flame retardance and high proof tracking index, and also has the advantages of short reaction period, superior mechanical performance, thermal stability, etc.

Description

technical field [0001] The invention relates to the field of epoxy resins, in particular to a high-CTI epoxy resin for copper-clad laminates and a preparation method thereof. Background technique [0002] The relative tracking index (CTI) is an indicator of the carbonized conductive path formed on the surface of the reactive insulating material in the presence of a potential difference, making it lose its insulation. The higher the CTI, the better its insulation. The CTI value of ordinary FR-4 plates is around 200V, while high CTI plates generally require more than 600V. With the safety of human life more and more widely concerned by the society. In order to improve the safety and reliability of electronic products, especially for the safety and reliability of insulating materials (such as motors, electrical appliances, etc.) used in humid environments, it is an important development in recent years to develop high-insulation products to ensure the safety and reliability o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08G59/14C08J5/24
CPCC08L63/00C08G59/1438C08J5/24C08L2201/08C08L2205/025C08L2205/02C08L2205/035C08J2363/00C08J2463/00C08J2463/04C08L63/04
Inventor 张广军
Owner 建滔(广州)电子材料制造有限公司
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