MEMS uncooled infrared detector thermal parameter test circuit and test method

Abstract

The invention relates to the field of electrical self-testing of thermal parameters of infrared detectors, in particular to an MEMS uncooled infrared detector thermal parameter test circuit and test method. The MEMS uncooled infrared detector thermal parameter test circuit comprises: an MEMS uncooled infrared detector array which comprises a plurality of rows and columns of infrared sensitive units; an array gating switch used for gating the sensitive units in the MEMS uncooled infrared detector array in turn and outputting electrical signals generated by the selected sensitive units to an amplification operational circuit; the amplification operational circuit is used for carrying out amplification operation on the change of the electrical signal and outputting an amplification operationresult to a data processing module; a power supply module used for supplying power to the infrared sensitive unit selected by the array gating switch; and the data processing module used for calculating to obtain a heat capacity C, a thermal response time [tau], a thermal conductivity G, a blackbody response rate RIR and an infrared absorption efficiency [eta] of the device according to the actualtest data of the amplification operational circuit.

Description

technical field [0001] The invention relates to the field of electrical self-testing of thermal parameters of micro-nano devices, in particular to a test circuit and method for thermal parameters of MEMS uncooled infrared detectors based on self-heating effects. Background technique [0002] Micro-electromechanical systems (MEMS), also known as micro-electro-mechanical systems or micro-mechanical systems, are developed on the basis of microelectronics technology (semiconductor manufacturing technology). Common products include accelerometers, microphones, gyroscopes, humidity sensors, gas sensors, infrared detectors, and more. At present, thermal MEMS sensors based on the principle of thermal characteristics are widely used in national defense, medical, security, aerospace, environmental monitoring, automotive electronics and other fields, and have the characteristics of miniaturization, intelligence, multi-function, high integration and mass production. [0003] Infrared r...

AI Technical Summary

Problems solved by technology

[0005] At present, the determination of structure and process size for thermal parameter design mainly relies on rough design methods such as simulation and estimation, which have large errors and long design cycles

However, domestic testing of thermal parameters requires the use of scarce and expensive external testing equipment. The testing system is complex, inconvenient to operate, and low in testing efficiency. Especially for array devices, the time cost of testing is high.

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