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Packaging structure, electronic device and packaging method

A technology of packaging structure and packaging method, which is applied in the direction of antenna support/mounting device, circuit, electrical components, etc., and can solve the problems of inability to meet high performance requirements and large impact of signal amplitude loss

Active Publication Date: 2021-04-09
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the length of the transmission path in the millimeter-wave frequency band has a great impact on the signal amplitude loss, the traditional antenna architecture mode has gradually been unable to meet the high-performance requirements.

Method used

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  • Packaging structure, electronic device and packaging method
  • Packaging structure, electronic device and packaging method
  • Packaging structure, electronic device and packaging method

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Embodiment Construction

[0034] see figure 1 , the embodiment of the present application provides a package structure 100 including a first substrate 10 , a second substrate 30 and a chip 50 . The first substrate 10 includes an upper surface 101 and a lower surface 102 oppositely arranged, the second substrate 30 is mounted on the upper surface 101 of the first substrate 10, and the chip 50 is fixed on the lower surface 102 on. The second substrate 30 includes an upper surface 103 and a lower surface 104 oppositely disposed, and the lower surface 104 of the second substrate 30 is disposed facing the first substrate 10 . It can be understood that the chip 50 is not limited to be fixed on the lower surface 102 of the first substrate 10, and the chip 50 can be fixed in the receiving groove / hole by digging a receiving groove / hole in the first substrate 10, here Not limited.

[0035] The upper surface 101 of the first substrate 10 is provided with spaced protrusions 15 , the lower surface 104 of the sec...

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Abstract

The present invention provides a packaging structure, including a first substrate, a second substrate and a chip, the second substrate is mounted on the upper surface of the first substrate, the chip is mounted on the first substrate, and The upper surface of the first substrate is provided with spaced protrusions, the lower surface of the second substrate is provided with spaced protrusions, the protrusions on the first substrate and the protrusions on the second substrate The protrusions are opposite to each other and surround a bonding area and an antenna area for accommodating antenna radiators between the first substrate and the second substrate. The second substrate is provided with a through hole, and the through hole is connected to the second substrate. The bonding area communicates, and the bonding colloid in the through hole and the bonding area overflows from the bonding area into the through hole and solidifies to form a rivet structure. The through hole prevents the bonding colloid from overflowing and contaminating the antenna area during packaging, so as to ensure the antenna performance of the packaging structure, thereby improving the reliability of the packaging structure. The invention also provides an electronic device and a packaging method.

Description

technical field [0001] The invention relates to the technical field of communications, and in particular to a packaging structure, an electronic device and a packaging method. Background technique [0002] With the advent of the high-speed communication era such as 5G, millimeter wave communication has gradually become the mainstream, and the design and application requirements of millimeter wave antennas are becoming more and more vigorous. Since the length of the transmission path in the millimeter-wave frequency band has a great impact on the signal amplitude loss, the traditional antenna architecture mode has gradually been unable to meet the high-performance requirements. Antenna in Package (AiP) architecture can maximize the Equivalent Isotropic Radiated Power (EIRP) value of the wireless system due to the extremely short antenna feeder path, which is conducive to wider coverage, so AiP The technology has gradually become the mainstream antenna technology for 5G and m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/58H01Q1/22H01L21/50
CPCH01L21/50H01L23/488H01L23/58H01Q1/2283H01L2224/16225H01Q1/22
Inventor 常明林来存刘亮胜曲恒
Owner HUAWEI TECH CO LTD
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