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Adhesive tape for semiconductor substrate processing and method for manufacturing semiconductor device

A semiconductor and adhesive tape technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as inability to easily, and achieve the effects of reducing adhesion, improving low stress, and excellent reliability

Active Publication Date: 2020-09-29
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unable to easily pick up semiconductor sealing body from adhesive tape for semiconductor substrate processing

Method used

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  • Adhesive tape for semiconductor substrate processing and method for manufacturing semiconductor device
  • Adhesive tape for semiconductor substrate processing and method for manufacturing semiconductor device
  • Adhesive tape for semiconductor substrate processing and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0337]

[0338] As the resin for forming the incision layer, ionomer resin "Himilan 1855" was used.

[0339] Furthermore, 80.0 mass % of low density polyethylene LDPE "F222" and 20.0 mass % of antistatic agents "Pelestat 212" were dry-blended, and the resin composition for expansion layer formation was obtained.

[0340] Then, the obtained resin composition for forming an incision layer and the resin composition for forming an expansion layer were supplied to each extruder adjusted to 200° C., and extruded from a 2-layer die at 200° C. so as to be the order of an incision layer / expansion layer It was taken out, cooled and solidified with a cooling roll set at 20° C., and wound up in a substantially unstretched state to obtain a substrate 4 having a two-layer structure.

[0341] In addition, the thickness of the incision layer 41 in the obtained base material 4 was 100 μm, the thickness of the expansion layer 42 was 50 μm, and the thickness of the base material 4 as a whole w...

Embodiment 2～6、 comparative example 1

[0345]Except having changed the kind of raw material as described in Table 1, the base material 4 and the adhesive tape 100 of Examples 2-5 and Comparative Example 1 were produced in the same manner as Example 1.

[0346] 3. Evaluation

[0347]

[0348] The adhesive force of the adhesive layer under the condition of 25° C. before energy application was evaluated as follows.

[0349] That is, first, the adhesive tapes 100 of Examples 1 to 6 and Comparative Example 1 were bonded according to JIS Z 0237 using an adhesion tester TAC-II of RHESCA CO., LTD. The layer is facing upward, and it is brought into contact with a probe made of SUS304 with a diameter of 5.0mm from the upper side. At this time, the speed when the probe is in contact with the adhesive layer is set to 10mm / sec, the contact load is set to 200gf, and the contact time is set to Set to 1 second, and set the probe temperature and plate temperature to 25°C. Then, the probe was peeled upward at a peeling speed of ...

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Abstract

According to the present invention, it is possible to provide an adhesive tape for processing a semiconductor substrate, which includes a base material and an adhesive layer laminated on one surface of the base material, and is used for cutting a semiconductor sealing connector in the thickness direction to obtain In the case of a plurality of sealed semiconductors, the semiconductor sealed connection is temporarily fixed to the base material through the adhesive layer, and the semiconductor sealed connection includes a substrate, a plurality of semiconductor elements arranged on the substrate, and a plurality of A sealing portion for sealing a semiconductor element, wherein the adhesive layer contains a release agent for reducing the pressure between the adhesive layer and the sealing portion when the semiconductor sealing body is peeled off from the adhesive tape for processing a semiconductor substrate. Adhesiveness, the aforementioned sealing portion is composed of a sealing material containing an epoxy group-containing compound, the aforementioned epoxy group-containing compound has a double bond in its molecular structure, and the aforementioned release agent is silicone-based oil or fluorine-based surfactant agent.

Description

technical field [0001] The present invention relates to an adhesive tape for processing a semiconductor substrate and a method for manufacturing a semiconductor device. Background technique [0002] In recent years, along with the high functionality of electronic equipment and the expansion of mobile applications, the demand for high density and high integration of semiconductor devices has been strengthened, and the increase in capacity and density of IC packages has been progressing. [0003] Examples of such a semiconductor device include a semiconductor device in which a semiconductor element is mounted on a substrate to be modularized. Furthermore, as a method of manufacturing the semiconductor device, for example, the following method has been proposed. [0004] That is, first, a plurality of semiconductor elements are placed on a substrate, and then, in order to cover the semiconductor elements placed on the substrate, they are sealed with a sealing portion made of a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301H01L21/56
CPCH01L21/56H01L2224/11
Inventor 长尾佳典
Owner SUMITOMO BAKELITE CO LTD
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