8results about How to "Eliminate processing stress" patented technology

The invention discloses a high-corrosion-resistance high-conductivity electroplated palladium / gold-plated palladium-copper bonding wire and a production process thereof, and relates to the technical field of bonding wires, in order to improve the corrosion resistance of the bonding wire, the bonding wire is improved by modifying a core material and preparing a composite coating; according to the method, firstly, the core layer is improved, the corrosion potential of a core material is greatly improved by adding graphene into the core layer, the copper core has good heat dissipation performance and high-temperature conductivity, heat is prevented from being accumulated and heated in the bonding wire, and on the basis, the coating is improved, so that the corrosion resistance of the copper core is improved, and the service life of the copper core is prolonged. The surface appearance of an electroplating coating is improved by reducing the concentration of metal ions in an electroplating solution, increasing a pore filling agent and performing pulse current electroplating, diffusion layers are formed between the graphene copper alloy core and different electroplating layers through annealing treatment, the bonding strength between the graphene copper alloy core and the different electroplating layers is improved, and the use performance of the bonding wire is improved.

The application discloses a rolling-drawing combined forming method for a titanium alloy small-diameter thick-wall pipe in the technical field of metal pipe processing, and aims at the technical problems of poor size uniformity of the titanium alloy small-diameter thick-wall pipe, defects such as easy folding and scratching of an inner wall, and low flaw detection qualified rate in the prior art, and provides a rolling-drawing-rolling combined forming system integration method, realizes synchronous optimization of pipe size precision, surface quality and internal organization through a complete process chain of vertical extrusion blanking, surface treatment and finishing forming, annealing straightening and machining finishing, composite coating protection and multi-pass drawing, precision finishing and multi-pass rolling annealing and finished product flaw detection treatment. The method adopts a composite lubrication system combining copper plating and MoS2 solid coating, cooperates with coupling regulation and control of deformation and Q value and a differential interpass annealing system, effectively inhibits the generation and inheritance of inner wall defects in the forming process, and significantly improves production efficiency and product quality stability.

The invention discloses a method for improving the bottom layer quality of copper-containing oriented silicon steel and the copper-containing oriented silicon steel, and belongs to the technical field of electrical steel manufacturing. The method for improving the quality of the copper-containing oriented silicon steel bottom layer comprises the steps that molten steel with specific components is smelted and then subjected to continuous casting to form a blank, then the plate blank is subjected to heating, hot rolling and acid pickling and then subjected to primary cold rolling to obtain a primary cold-rolled plate, then the primary cold-rolled plate is subjected to intermediate annealing and secondary cold rolling to obtain a secondary cold-rolled plate, and the secondary cold-rolled plate is subjected to hot rolling and acid pickling to obtain the copper-containing oriented silicon steel bottom layer. And after decarburization annealing is conducted on the secondary cold-rolled sheet, the secondary cold-rolled sheet is coated with a separant, then high-temperature annealing and purification annealing are conducted in sequence, and finally uncoiling, flat stretching annealing and insulating coating coating are conducted to obtain the copper-containing oriented silicon steel. According to the method, the machining stress of secondary rolling is eliminated, the situation that the oxidation film is broken due to the too large pressing rate is avoided, the glass film bottom layer good in quality is obtained, the magnetic performance of a product is improved, and iron loss is reduced.

A spinning processing method of a super high strength steel large diameter cylindrical part, the present application realizes high precision spinning forming of the super high strength steel large diameter cylindrical part through the forming method of first pass, second pass continuous spinning + intermediate annealing + third pass, fourth pass continuous spinning by a three spinning wheel vertical numerical control powerful spinning machine. The present application is more stable in metal flow during powerful spinning process, realizes iterative optimization of product processing process precision, and the processed cylindrical part has good apparent quality and high precision. The present application defines the heat treatment opportunity in the spinning pass of the super high strength steel cylindrical part, eliminates processing stress through recrystallization annealing, improves the fiber state of the structure, restores the deformation plasticity of the spinning cylindrical part, greatly improves the spinning processing efficiency of the large diameter 31Si2MnCrMoV super high strength steel cylindrical part under the premise of ensuring the internal and external quality of the cylindrical part. The present application lays a technical foundation for the batch application of 31Si2MnCrMoV super high strength steel in the manufacture of large light weight ultra-thin high strength shell.

The invention relates to the technical field of alloy processing, and particularly discloses a tungsten alloy filament and a preparation method thereof. The tungsten alloy filament provided by the invention comprises the following components in percentage by mass: 1.8%-2% of Cu, 0.1%-0.12% of C, 0.5%-0.8% of Ti, 0.7%-0.9% of Cr, 5.5%-7.5% of Mo and the balance of W and inevitable impurities. According to the tungsten alloy filament and the preparation method thereof, the adding elements and the adding amount in the tungsten alloy are reasonably controlled, and the tungsten alloy filament provided by the invention has excellent ductility and strength through composite strengthening of all the elements and has important practical value for actual production.

The invention relates to the technical field of bearing block machining, in particular to a radial tilting pad bearing block machining method which comprises the steps of blanking, rough turning, linear cutting, hardening and tempering, subdivision face milling, drilling, semi-finish turning, drilling, annealing, inner hole laser quenching, annealing, subdivision face accurate grinding, positioning pin hole machining, drilling, finish turning and demagnetization. According to the method, the inner hole laser quenching procedure is added, on the premise that it is guaranteed that the overall hardness of the bearing seat meets the use requirement, the hardness of the inner hole is improved to 45 HRC or above, the machining quality and machining efficiency of the bearing seat are guaranteed, and large deformation and thermal stress formation of the bearing seat cannot be caused by laser local quenching.

This invention relates to the field of fire-resistant insulated cable manufacturing technology, and discloses a continuous manufacturing process for high-yield mineral-insulated fire-resistant cables, comprising: pretreatment, drawing pure copper rods into wires and then stranding and pressing them to obtain stranded copper conductors; insulation wrapping, wrapping mica tape around the outer wall of the stranded copper conductors to obtain an insulating core; filling and forming, longitudinally wrapping copper tape around the outer wall of the insulating core, and filling the space between the copper tape and the insulating core with magnesium oxide powder to form an insulating layer; sheath welding, welding the gaps between the copper tapes after longitudinal wrapping to obtain a copper protective sheath; corrugating and shaping, rounding the copper protective sheath, and then rolling the copper protective sheath into a corrugated tube shape to obtain a cable; softening and straightening, performing a first annealing treatment and a second annealing treatment on the cable in sequence, and performing a first water cooling treatment on the cable after the first annealing treatment; protection and cooling, placing the cable after step six into a nitrogen pipeline for cooling, and then performing a second water cooling treatment on the cable.

The utility model provides a chip eutectic soldering pressing block, a chip eutectic soldering positioning sheet and a soldering device, the pressing block comprises a pressing block body made of ceramic material, and the pressing block body is provided with a plurality of salient points. According to the utility model, as the chip eutectic soldering pressing block and the chip eutectic soldering positioning sheet are both made of the ceramic material, the cost is reduced, the flatness is improved, the chip eutectic soldering pressing block and the chip eutectic soldering positioning sheet are prevented from being adhered with soldering tin during eutectic soldering, demolding is easy, dust cannot fall off, and the surface of the chip is prevented from being polluted. Meanwhile, the pressing block body and the positioning body can be respectively processed by adopting a laser processing technology to form the convex points and the accommodating grooves, so that the processing stress is eliminated, the thicknesses of the chip eutectic welding pressing block and the chip eutectic welding positioning piece and the sizes of the convex points and the accommodating grooves are not limited, the convex points with any patterns and the accommodating grooves with any micro-spacing can be processed, and the chip eutectic welding pressing block can be used for chip eutectic welding. The heights, sizes and positions of the salient points and the accommodating grooves can be flexibly designed according to the patterns on the surface of the chip.