The invention relates to a square 
cutting, edge 
cutting and 
polishing all-in-one 
machine, and belongs to the technical field of 
crystalline silicon machining equipment. The all-in-one 
machine comprises a base, wherein a sliding rail is arranged on the base, a feeding 
workbench mechanism, a centering mechanism, a squaring mechanism, a 
scrap edge falling mechanism and at least two 
polishing mechanisms are sequentially arranged on the sliding rail along the conveying direction of 
crystalline silicon, the feeding 
workbench mechanism is used for bearing the 
crystalline silicon and driving the crystalline 
silicon to move along the sliding rail, 
cutting lines bypass a squaring net of the squaring mechanism and form parallel lines, the 
scrap edge falling mechanism is used for sucking 
scrap edges generated under the cutting of the squaring mechanism, and the at least two 
polishing mechanisms are symmetrically arranged along the sliding rail. According to the all-in-one 
machine, the squaring mechanism and the polishing mechanism are integrated into one, and the 
crystal silicon can directly enter the 
slicing process after being machined at one time; the squaring mechanism adopts a form of two-wire squaring, so that cutting the 
crystal silicon into square bars and removing edges and corners are realized, the 
grinding allowance of the 
grinding procedure is reduced, and the rough 
grinding procedure is omitted; and a 
crystal bar is subjected to edge and corner 
machining immediately following one-time polishing after 
cut into the square bars, so that the grinding efficiency is remarkably improved.