The invention relates to a square
cutting, edge
cutting and
polishing all-in-one
machine, and belongs to the technical field of
crystalline silicon machining equipment. The all-in-one
machine comprises a base, wherein a sliding rail is arranged on the base, a feeding
workbench mechanism, a centering mechanism, a squaring mechanism, a
scrap edge falling mechanism and at least two
polishing mechanisms are sequentially arranged on the sliding rail along the conveying direction of
crystalline silicon, the feeding
workbench mechanism is used for bearing the
crystalline silicon and driving the crystalline
silicon to move along the sliding rail,
cutting lines bypass a squaring net of the squaring mechanism and form parallel lines, the
scrap edge falling mechanism is used for sucking
scrap edges generated under the cutting of the squaring mechanism, and the at least two
polishing mechanisms are symmetrically arranged along the sliding rail. According to the all-in-one
machine, the squaring mechanism and the polishing mechanism are integrated into one, and the
crystal silicon can directly enter the
slicing process after being machined at one time; the squaring mechanism adopts a form of two-wire squaring, so that cutting the
crystal silicon into square bars and removing edges and corners are realized, the
grinding allowance of the
grinding procedure is reduced, and the rough
grinding procedure is omitted; and a
crystal bar is subjected to edge and corner
machining immediately following one-time polishing after
cut into the square bars, so that the grinding efficiency is remarkably improved.